Patents by Inventor Samuel R. Wennberg

Samuel R. Wennberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder joint encapsulation material
    Patent number: 5759730
    Abstract: A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: June 2, 1998
    Assignee: Delco Electronics Corporation
    Inventors: Ralph D. Hermansen, Theresa Renee Lindley, Samuel R. Wennberg, Henry Morris Sanftleben, James M. Rosson
  • Hot melt epoxy encapsulation material
    Patent number: 5708056
    Abstract: A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: January 13, 1998
    Assignees: Delco Electronics Corporation, Hughes Electronics
    Inventors: Theresa Renee Lindley, Samuel R. Wennberg, Henry Morris Sanftleben, James M. Rosson, Ralph D. Hermansen