Abstract: An assembly of multiple quantities of solid state memory modules, built upon a high density interconnect substrate, is described. Each memory module is of itself constructed from a multiple number of separate bare solid state memory die appropriate to the function. A multiplicity of the memory modules are constructed on a single substrate, and thereupon each module is separated from the single substrate. The separate memory die are mounted to the surface of the high density substrate, which provides the interconnection necessary to complete the memory function. The high density substrate also provides the capability for close attached capacitors for signal filtering, test vias for optimal module test and thermal vias as appropriate. The provision for multiple memory modules enables economical manufacturing plus capability for systems level interconnect.

Abstract: A method and article made by such method are described for connecting electrodes on one face of an integrated circuit semiconductor device with those on a supporting substrate. The method comprises positioning electrodes formed on one face of the device into engagement with electrodes formed on the substrate. A force is applied to press the electrodes together and during application of the force a first adhesive is applied along only a minor portion of two edges of the device. The first adhesive is stiffened to provide a temporary connection of the device and the substrate. A mass of a second adhesive is applied over a face of said device opposite said one face and onto portions of the substrate adjacent the periphery of the device with substantially no adhesive located between the one face of the device and the substrate at a center area of the one face. The second adhesive is hardened to form an adhesive dome that permanently connects the device to the substrate.

Abstract: The electrode structure for selectively energizing a particular light emitting diode site of a light emitting diode array chip includes a narrow electrode strip connected at one end to the diode site, a test pad wider than the conductor strip electrically connected to the other end thereof, a bonding pad wider than said electrode strip and spaced from the test pad opposite the diode site and a severable connecting strip narrower than either pad electrically connecting those two pads to each other.