Patents by Inventor Samuel Richard Harrell, Jr.

Samuel Richard Harrell, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Submount structures for light emitting diode packages
    Patent number: 11837684
    Abstract: Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: December 5, 2023
    Assignee: CreeLED, Inc.
    Inventors: David Suich, Daniel E. Stasiw, Samuel Richard Harrell, Jr.
  • SUBMOUNT STRUCTURES FOR LIGHT EMITTING DIODE PACKAGES
    Publication number: 20210159368
    Abstract: Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.
    Type: Application
    Filed: November 21, 2019
    Publication date: May 27, 2021
    Inventors: David Suich, Daniel E. Stasiw, Samuel Richard Harrell, JR.
  • Light emitting device
    Patent number: D851790
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: June 18, 2019
    Assignee: Cree, Inc.
    Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Samuel Richard Harrell, Jr., Erin R. F. Welch, Roshan Murthy
  • Light emitting device
    Patent number: D890961
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: July 21, 2020
    Assignee: Cree, Inc.
    Inventors: Jesse Colin Reiherzer, Colin Kelly Blakely, Samuel Richard Harrell, Jr., Erin R. F. Welch, Roshan Murthy