Abstract: An extraction tool is described for use with integrated circuit (IC) packages of the type having a metallic heat sink member fused to the chip-enclosing ceramic body. The tool finds particular application in connection with a patented high package density island configuration wherein each IC package is secured on a retention post of a connector which is mounted between, and in close proximity to, adjacent parallel sections of the island cooling frame. The IC package heat sink member has at least one integral extension adapted to contact the frame. In performing its removal function, the present tool is capable of gripping opposite edges of the heat sink member in the limited space between the connector and cooling frame section. Having engaged the heat sink, the tool now permits the initial application of opposing forces respectively to the heat sink and the connector retention post.

Abstract: The present disclosure describes a wire guide for use with a manually operated wire wrap gun. Such guns are used to make solderless wrapped connections on terminals emanating from a circuit board. The wire guide of the present invention is especially useful with multi-spindle guns, such as the dual spindle gun utilized for simultaneously wrapping both wires of a twisted pair or miniature coaxial cable. The present wire guide which is fastened to the sleeve portion of the gun, permits the operator to front load the gun quickly and reliably by directing the multiple wires into the respective wire feed openings of the wrapping tool bits housed within the sleeves.