Patents by Inventor Samuel Riemersma

Samuel Riemersma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Circuitry and Methods for Manufacturing Same
    Publication number: 20190371723
    Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 5, 2019
    Inventors: Andrew DePaula, Samuel Riemersma, Charles Harral
  • Integrated circuitry and methods for manufacturing same
    Patent number: 10388599
    Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: August 20, 2019
    Inventors: Andrew DePaula, Samuel Riemersma, Charles Harral
  • Integrated Circuitry and Methods for Manufacturing Same
    Publication number: 20170069566
    Abstract: Processes for manufacturing cellulose based integrated circuitry constructions are provided, the processes can include providing a first substrate having a plurality of vias; providing a first conductive material to the one surface of the substrate; providing adhesive to the other surface; providing a monolithic electronic component to the other surface; providing a second conductive material to the other surface and the monolithic electronic component; providing a backing material to the other surface of the substrate; and providing a second substrate to the backing material to form the construction.
    Type: Application
    Filed: March 2, 2015
    Publication date: March 9, 2017
    Applicant: INTELLIPAPER, LLC
    Inventors: Andrew DePaula, Samuel Riemersma, Charles Harral