Patents by Inventor Samuel Roy McKnight

Samuel Roy McKnight has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of Creating Molds of Variable Solder Volumes for Flip Attach
    Publication number: 20090004840
    Abstract: A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.
    Type: Application
    Filed: June 27, 2007
    Publication date: January 1, 2009
    Inventors: Matthew J. Farinelli, Steven Cordes, Donna S. Nielsen, Samuel Roy McKnight, Jay S. Chey, Peter A. Gruber, Joanna Rosner
  • Methods of Creating Molds of Variable Solder Volumes for Flip Attach
    Publication number: 20090001248
    Abstract: A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.
    Type: Application
    Filed: August 23, 2007
    Publication date: January 1, 2009
    Inventors: Matthew J. Farinelli, Steven Cordes, Donna S. Nielsen, Samuel Roy McKnight, Jay S. Chey, Peter A. Gruber, Joanna Rosner
  • Internally reinforced bond pads
    Patent number: 7273804
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: September 25, 2007
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Internally reinforced bond pads
    Patent number: 6864578
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: March 8, 2005
    Assignee: International Business Machines Corporation
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Internally reinforced bond pads
    Publication number: 20040195642
    Abstract: Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.
    Type: Application
    Filed: April 3, 2003
    Publication date: October 7, 2004
    Inventors: David Angell, Frederic Beaulieu, Takashi Hisada, Adreanne Kelly, Samuel Roy McKnight, Hiromitsu Miyai, Kevin Shawn Petrarca, Wolfgang Sauter, Richard Paul Volant, Caitlin W. Weinstein
  • Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
    Patent number: 6747472
    Abstract: A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: June 8, 2004
    Assignee: International Business Machines Corporation
    Inventors: John Harold Magerlein, Samuel Roy McKnight, Kevin Shawn Petrarca, Sampath Purushothaman, Carlos Juan Sambucetti, Joseph J. Van Horn, Richard Paul Volant, George Frederick Walker
  • Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
    Publication number: 20030136813
    Abstract: A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John Harold Magerlein, Samuel Roy McKnight, Kevin Shawn Petrarca, Sampath Purushothaman, Carlos Juan Sambucetti, Joseph J. Van Horn, Richard Paul Volant, George Frederick Walker