Abstract: A method is provided of inserting an elongate element into a ground surface, including drilling at a first drilling location in the ground surface. The drilling is performed by a boring tool of a first vehicle. The elongate element is transported to the first drilling location. The transporting is performed by a second vehicle. The elongate element is handed off from the second vehicle to the first vehicle. The elongate element is inserted into the first drilling location. The inserting is performed by an inserting device of the first vehicle.

Abstract: Provided herein is an exemplary embodiment of a semiconductor chip for directly connecting to a carrier. The chip includes a metal layer applied to a top surface of the chip; a passivation layer applied over the metal layer such that portions of the passivation layer is selectively removed to create one or more openings (“bond pads”) exposing portions of the metal layer and one or more solderable metal contact regions formed on each of the one or more openings. The solderable metal contact regions electrically connect to the carrier when the chip is positioned face down on the carrier, supplied with a thin layer of solder and heated.

Abstract: A mobile terminal apparatus for satellite communication of voice data, facsimile and computer information, which consists of an RF transceiver section, an optional cellular board, and a processor board. The processor board has two digital signal processors and a multi-task control processor for controlling the operation of the signal processor.