Patents by Inventor Samuel Schimpf

Samuel Schimpf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hall sensor mounting in an implantable blood pump
    Patent number: 10413650
    Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: September 17, 2019
    Assignee: TC1 LLC
    Inventors: Samuel Schimpf, Mark McChrystal, Joseph C. Stark, III, Andre Siebenhaar
  • HALL SENSOR MOUNTING IN AN IMPLANTABLE BLOOD PUMP
    Publication number: 20170065755
    Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
    Type: Application
    Filed: October 5, 2016
    Publication date: March 9, 2017
    Inventors: Samuel Schimpf, Mark McChrystal, Joseph C. Stark, III, Andre Siebenhaar
  • Hall sensor mounting in an implantable blood pump
    Patent number: 9492599
    Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: November 15, 2016
    Assignee: THORATEC CORPORATION
    Inventors: Samuel Schimpf, Mark McChrystal, Joseph C. Stark, III, Andre Siebenhaar
  • Hall Sensor Mounting in an Implantable Blood Pump
    Publication number: 20140067056
    Abstract: A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 6, 2014
    Inventors: Samuel Schimpf, Mark McChrystal, Joseph C. Stark, III, Andre Siebenhaar