Patents by Inventor Samuel W. Donley

Samuel W. Donley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4171393
    Abstract: An improved method for the electroless plating of metals is accomplished by a sustainable direct metal-metal ion displacement reaction on porous metal surfaces. It is applicable whenever the plating metal is more electronegative than the porous metal surface on which it is to be plated. The porous metal must be a catalyst for the displacement reaction, and the pores of the porous metal surface must be large enough to enable plating solution to wet the internal surfaces of the pores and to enable cations of the porous metal to diffuse into the plating solution, but the pores must not be so large as to allow plating solution to circulate freely into them. The method comprises immersing an article having a porous metal surface in an alkaline aqueous solution containing cations of the plating metal. No chemical reducing agent for the metal cations is required in the plating bath.
    Type: Grant
    Filed: June 20, 1977
    Date of Patent: October 16, 1979
    Assignee: Eastman Kodak Company
    Inventors: Samuel W. Donley, Peter N. Bacel