Abstract: Methods may provide a virtual system with direct access to one or more sectors of a resource of a computer system. The method may include providing, by a computer system to a virtual system, first access control data associated with a regular computer file that corresponds to a resource on the computer system. The method may additionally include receiving, at the computer system, a direct read from or direct write to one or more sectors of the resource represented by the regular computer file from the virtual system. The method may further include hiding, at the computer system, a hidden computer file from the virtual system. The method may additionally include routing, at the computer system, the direct read from or direct write to the hidden computer file on the computer system.

Abstract: Systems and computer program products may provide a virtual system with direct access to one or more sectors of a resource of a computer system. The system and computer program products may include providing, by a computer system to a virtual system, first access control data associated with a regular computer file that corresponds to a resource on the computer system. The system and computer program products may additionally include receiving, at the computer system, a direct read from or direct write to one or more sectors of the resource represented by the regular computer file from the virtual system. The system and computer program products may further include hiding, at the computer system, a hidden computer file from the virtual system. The system and computer program products may additionally include routing, at the computer system, the direct read from or direct write to the hidden computer file on the computer system.

Abstract: Methods may provide a virtual system with direct access to one or more sectors of a resource of a computer system. The method may include providing, by a computer system to a virtual system, first access control data associated with a regular computer file that corresponds to a resource on the computer system. The method may additionally include receiving, at the computer system, a direct read from or direct write to one or more sectors of the resource represented by the regular computer file from the virtual system. The method may further include hiding, at the computer system, a hidden computer file from the virtual system. The method may additionally include routing, at the computer system, the direct read from or direct write to the hidden computer file on the computer system.

Abstract: Systems and computer program products may provide a virtual system with direct access to one or more sectors of a resource of a computer system. The system and computer program products may include providing, by a computer system to a virtual system, first access control data associated with a regular computer file that corresponds to a resource on the computer system. The system and computer program products may additionally include receiving, at the computer system, a direct read from or direct write to one or more sectors of the resource represented by the regular computer file from the virtual system. The system and computer program products may further include hiding, at the computer system, a hidden computer file from the virtual system. The system and computer program products may additionally include routing, at the computer system, the direct read from or direct write to the hidden computer file on the computer system.

Abstract: A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.

Abstract: A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.

Abstract: An integrated circuit package includes a package core and a primary circuitry chip mounted on the package core. The primary circuitry chip has an active surface in which the core circuitry is fabricated. The active surface of the primary circuitry chip faces the package core and includes contacts. The integrated circuit package further includes an auxiliary circuit chip assembled to the package core and having contacts facing and electrically connected to the contacts of the primary circuitry chip.

Abstract: A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.

Abstract: A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members' inductance.

Abstract: A method and apparatus for probing a circuit board, is provided. One implementation involves a signal probe including a tip having a plurality of strands of flexible conductive material surrounding the tip, the strands extending out from the tip to provide multiple points of contact with the rim of a via or a conductive barrel of the via when the tip is inserted into the via, the probe tip and probe strands being made of same conductive material; such that aligning the signal probe with the via for engaging the probe tip strands with the via, and inserting the tip into the via, causes bending and flexing of the strands for making contact with a conductor on a top rim of the barrel and inside an inner wall of the barrel.