Abstract: A silicon circuit board substrate is utilized in an electronic device in place of conventional PCB motherboard. The silicon circuit board substrate is adhered to the back side of a display assembly to provide structural support for the substrate. The silicon circuit board substrate and the display assembly may be electrically connected via contact pads provided on the respective sides of the substrate and the display assembly that are connected together.

Abstract: Systems and methods of manufacturing compact camera assemblies for use in electronic device are provided. The camera assemblies include an image sensor and a camera component. The camera assemblies further include a molding compound transfer molded onto the image sensor and the camera component to form a camera component subassembly. A redistribution layer is formed on a surface of the camera component subassembly. The redistribution layer includes at least one dielectric layer and a first interconnect layer. The camera assemblies further include a lens module coupled to the redistribution layer and aligned with the image sensor along an optical axis.

Abstract: An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.

Abstract: Described herein are manufacturing methods and camera system designs that provide precise alignment between multiple camera modules mounted on a common chassis. The chassis includes a plurality of mounting regions, with each mounting region including one or more mounting posts. Each camera module includes one or more guiding holes into which the mounting posts are inserted. By precisely positioning the guiding holes and the mounting posts, the alignment of the camera modules with the chassis and the other camera modules may be controlled with high precision.

Abstract: Described herein are manufacturing methods and camera system designs that provide precise alignment between multiple camera modules mounted on a common chassis. The chassis includes a plurality of mounting regions, with each mounting region including one or more mounting posts. Each camera module includes one or more guiding holes into which the mounting posts are inserted. By precisely positioning the guiding holes and the mounting posts, the alignment of the camera modules with the chassis and the other camera modules may be controlled with high precision.

Abstract: An imager module having an interposer chip electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip, the PCB, or both the interposer chip and the PCB. The interposer chip may further have a cavity therethrough to allow light to impinge in the image sensor. The interposer chip may still further have through silicon vias (TSVs) to route signals from the PCB to the VCM.

Abstract: An imager module having an interposer chip with castellated contacts electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. The VCM may be electrically coupled to the interposer chip via the castellated contacts. The castellated contacts may be formed by fabricating annular through silicon vias (TSVs) and then sawing through those annular TSVs. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip with castellated contacts. The interposer chip may further have a cavity therein within which the image sensor may be attached.

Abstract: An imager assembly having a molded package formed using a molded interconnect device (MID) technique having a rim portion protruding from a surface of the molded package is disclosed. A lens may be held by the rim portion protruding from the surface and an image sensor may be disposed on the surface. The molded package may further be mechanically and electrically coupled to an electromechanical device, such as a voice coil motor (VCM). The VCM may be configured to move the lens held by the molded package for the purposes of focusing an image on the image sensor. Additionally, an imager assembly with a sandwich molded package having a first high density interconnect (HDI) layer and a second HDI layer with surface mount devices (SMDs) and molding compound therebetween is disclosed. The imager assembly may further include an image sensor, lens assembly, and VCM disposed on the sandwich molded package.

Abstract: Various approaches discussed herein enable techniques for protecting die units made of silicon substrate. A substrate, or wafer, is provided that has multiple die units built onto it, as well as saw streets between the die units. The substrate is cut into along the saw streets at a first width, after which a coating is applied to a side of the wafer so that the side of the wafer is covered with the coating as well as the channels created by the cutting being substantially filled with the coating. After curing the coating, a second cut is made along the saw streets and through the cured coating, so that the individual die units, once separated, have a protective layer of the coating attached to one side and the periphery of the die unit.

Abstract: A disclosed method of manufacturing a camera module includes providing an optical assembly, providing an integrated circuit image capture device (ICD), fixing the optical assembly directly to the ICD, then forming a housing directly over the optical assembly. The method further includes forming the housing over the ICD and the optical assembly via transfer molding. The method further includes forming solder balls on the rear surface of the ICD so as to enable the camera module to be reflow soldered to a host device. In an alternative embodiment of the present invention, the method includes providing a second ICD, providing a second optical assembly, providing a housing substrate, fixing the first optical assembly over the first ICD, fixing the second optical assembly over the second ICD, and forming the housing substrate over both the first and second optical assemblies.

Abstract: An imager module having an interposer chip electrically connected to and routing signals between an image sensor, a printed circuit board (PCB), and a voice coil motor (VCM) is disclosed. In some example embodiments, one or more surface mount devices (SMDs) may further be attached to the interposer chip, the PCB, or both the interposer chip and the PCB. The interposer chip may further have a cavity therethrough to allow light to impinge in the image sensor. The interposer chip may still further have through silicon vias (TSVs) to route signals from the PCB to the VCM.

Abstract: Systems and methods of manufacturing compact camera modules for use in electronic device are provided. These designs may provide small form factor autofocus (AF) camera modules for incorporation into thin mobile devices, such as tablets or smartphones. The camera module includes a flexible tape substrate having an image sensor die wire bonded to an upper side of the substrate and a molded stiffener formed on the lower side of the substrate.

Abstract: Systems and methods of manufacturing compact camera modules for use in electronic device are provided. The camera module includes a lens housing and a substrate assembly. The substrate assembly includes a flexible substrate wrapped around a molded enclosure. The optical image stabilization components for the camera module may be enclosed within the molded enclosure.

Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.

Abstract: Systems and methods of manufacturing compact camera modules for use in electronic device are provided. The camera module includes a lens housing and a flexible substrate. An image sensor die is coupled to a first portion of the flexible substrate, and a second portion of the substrate is folded so as to position optical image stabilization components adjacent to a lateral side of the lens housing. The optical image stabilization components may be enclosed within a molded enclosure.

Abstract: Systems and methods of manufacturing compact camera modules for use in electronic device are provided. The camera module includes a flexible tape substrate having an image sensor die wire bonded to an upper side of the substrate and a rigid stiffener formed on the lower side of the tape substrate. A spacer member supports an optical filter above the image sensor die and the bond wires.

Abstract: A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality of individual protective covers, providing a unitary component substrate including a plurality of individual component parts, bonding the unitary transparent substrate to the unitary component substrate, dividing the transparent substrate into a plurality of discrete protective covers, and separating the component parts from one another. According to one particular method, the component substrate is a semiconductor wafer having a plurality of integrated electronic image capture devices formed therein. According to another particular method, the component substrate is a circuit board having a plurality of individual device circuit boards formed therein.

Abstract: A integrated camera module (10, 10a) for capturing video images in very small digital cameras, cell phones, personal digital assistants, and the like. A lens assembly (24, 24a) is rigidly affixed in relation to a sensor array area (14) of a camera chip (12) by a molding (26). The molding (26) is formed on the camera chip (12), and optionally on a printed circuit board (16, 16a) on which the camera chip (12) is mounted. The lens assembly (24, 24a) is held in place in a recess (29) of the molding (26) by an adhesive (28). The molding (26) is formed such that a precise gap (30) exists between the lens assembly (24) and a sensor array area (14) of the camera chip (12).

Abstract: A novel design and method for manufacturing camera modules is disclosed. The camera module includes a flexible circuit substrate, an image capture device flip-chip mounted to the bottom surface of the flexible circuit substrate, a housing mounted over the top surface of the flexible circuit substrate, and a lens unit coupled to the housing. In an example embodiment, the camera module includes a stiffener formed directly over a plurality of electrical components mounted on the top surface of the flexible circuit substrate. In another example embodiment, the bottom surface of the flexible circuit substrate defines a recessed portion whereon the image capture device is flip-chip mounted.

Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.