Abstract: A light device with multiple LED light sources includes a metal conductive plate and a plurality of LED elements. The metal conductive plate consists of plural plate members, and a slot is defined between every two adjacent plate members for physically separating the two adjacent plate members. Each LED element is electrically connected to the plate members disposed at two sides of the slot. The LED elements are electrically connected in series or in parallel through the plate members disposed at the two sides of the slot.

Abstract: The present invention discloses a heat conductive composite substrate having heat dissipation properties and a manufacturing method thereof. The heat conductive composite substrate comprises a heat dissipation substrate and a metal diamond composite layer physically disposed on the heat dissipation substrate for passing heat energy to the heat dissipation substrate. The metal diamond composite layer is a growth substance including at least one kind metal, and the growth substance is distributed with plural diamond particles therein.

Abstract: A light device with multiple LED light sources includes a metal conductive plate and a plurality of LED elements. The metal conductive plate consists of plural plate members, and a slot is defined between every two adjacent plate members for physically separating the two adjacent plate members. Each LED element is electrically connected to the plate members disposed at two sides of the slot. The LED elements are electrically connected in series or in parallel through the plate members disposed at the two sides of the slot.

Abstract: A light emitting device and method for manufacturing the same are provided. Accordingly, the device comprises a fixture disposed on a submoumt; an inner space formed within the fixture for containing at least one light emitting diode; a fluorescent layer disposed into the inner space to cover the light emitting diode, wherein the length between the light emitting diode and the fixture is similar for having a uniformed color light.

Abstract: The present invention relates to a package structure of light emitting device, comprising a light emitting diode disposed on a submount, wherein the light emitting diode comprises a first contact and a second contact respectively connected with a first conductive lead and a second conductive lead of the submount. The first conductive lead and second conductive lead of the submount are electrically connected with a print circuit board. As a result, the light emitting diode is electrically connected with the print circuit board without the wire bonding process, and the power can be supplied to the light emitting diode through the print circuit board.

Abstract: A light emitting device for enhancing brightness is provided, comprising a first contact and a second contact provided on a light emitting diode and respectively connected with a first conductive lead and a second conductive of a transparent submount such that can achieve the purpose of supplying power for the light emitting diode, and a reflective layer disposed on other surface of the transparent submount, wherein a downward light generated from the light emitting diode can pass through the light emitting diode and the transparent submount to the outside of the light emitting device. Therefore, the brightness of the light emitting device can be enhanced.

Abstract: The invention discloses a light-emitting diode lamp with high heat dissipation that uses the high heat conductible material to make the lamp cavity and coordinates with the design of directly adhering base of the flip-chip light-emitting diodes and the cavity to achieve the purpose of guiding light and dissipating heat. The flip-chip light-emitting diode is used and arranged in matrix, the brightness and the uniformity can be effectively improved. The present invention can be applied to be the light source of the liquid crystal display, the advertisement board, the scanner and so on.

Abstract: A package array and its package unit of flip chip LED are proposed, wherein an LED chip is mounted on a ceramic material capable of enduing the eutectic temperature of the fabrication process for packaging. Next, metal wires are directly distributed on the ceramic material to finish an LED package unit, or a plurality of LEDs are serial/parallel connected with metal wires on the ceramic material to finish a high density package array. Because the ceramic material has a good thermal expansion match and a good thermal conductivity and the LED chip itself has a high reflective index match, the light emission characteristic and heat-radiating effect of the packaged LED can be effectively improved.

Abstract: A light-emitting device is provided, having a light-reflecting layer on a power substrate, the main structure of which comprises a power substrate, at least one light-emitting die fixedly provided on a top surface of the power substrate, a light-reflecting body surroundingly provided around the periphery of the power substrate and light-emitting die, and a supporting foundation. At a side surface of the power substrate, there is coated with at least one light-reflecting layer, by which a side light source generated from the light-emitting die may be reflected out of the light-emitting device, free from being absorbed by the power substrate, thus raising the brightness of the light-emitting device.

Abstract: A light-emitting diode (LED) device with at least three pins, mainly comprises an accommodating base provided therein with an electrostatic discharge protection device and at least one light-emitting die adhered onto this electrostatic discharge protection device in the manner of flip-chip, in such a way that a first electrode and a second electrode of the light-emitting die are electrically connected to a first protective electrode and a second protective electrode of the electrostatic discharge protection device, respectively and correspondingly. The accommodating base is connectedly provided with at least one heat-dissipating pin, and at the side of this accommodating base, a first electro-conductive pin and a second electro-conductive pin are provided, such that the first protective electrode and the second protective electrode are electrically connected thereto, respectively.

Abstract: A light-emitting device is provided. The device is with an enlarged active light-emitting region, mainly comprising a LED substrate provided with a first material layer and a second material layer on the top surface thereof in turn, and a PN junction formed between the first material layer and the second material layer naturally. Moreover, a first extended trench, allowed for passing through the second material layer and a part of the first material layer, is provided, and a first extended electrode is disposed inside the first extended trench. The electrical connection between the first extended electrode and the first electrode disposed on one part of top surface of the second material layer is made, such that the first electrode may be located at a horizontal level approximately identical to that of a second electrode equally disposed at the other part of top surface of the second material.

Abstract: A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Abstract: A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Abstract: A position-detecting device is provided. The optical position-detecting device essentially comprises a light-emitting source, a mask, and a light-detecting device, in which a plurality of grating-holes are provided on the mask for allowing of a projecting light source, generated by the light-emitting source, to pass therethrough, and the projecting light source passing through the grating-holes are then absorbed by a plurality of light-detecting element provided on the light-detecting device. Each light-detecting device is provided as a non-rectangular mode, while an interval space is existed between any two of adjacent light-detecting elements. The partially active area of one of the light-detecting elements is naturally provided at the vertical extension of the interval space, and thus diminishing disadvantages of misdetermination and low sensitivity of the light-detecting device induced by the presence of an interval space.

Abstract: A light-emitting diode with enhanced brightness and a method for fabricating the diode is provided. The light-emitting diode includes an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of windows formed in a highly doped layer. At least one conductive contact is formed on the bottom surface of the highly doped layer. A transparent material layer is formed in the windows. An adhesion layer is formed between the transparent material layer and a permanent substrate. A bottom electrode is formed on the bottom surface of the permanent substrate and an opposed electrode is formed on the top surface of the epitaxial LED structure.

Abstract: The present invention discloses a light-emitting diode with enhanced light-emitting efficiency, in which the active current is prevented from flowing in the region under the top electrode so that the light-emitting efficiency as well as the brightness can be improved.

Abstract: The present invention discloses a light-emitting diode with enhanced brightness and a method for fabricating the same. The light-emitting diode comprises: an epitaxial LED structure having at least one lighting-emitting active layer with a plurality of spacers inside the lighting-emitting active layer; at least one conductive contact, formed on the bottom surface where no spacer is formed inside the lighting-emitting active layer; a transparent material layer formed in the spacers; an adhesion layer formed between the transparent material layer and a permanent substrate; a bottom electrode formed on the bottom surface of the permanent substrate; and an opposed electrode formed on the top surface of the epitaxial LED structure.

Abstract: A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

Abstract: The present invention discloses an electroluminescent device with a drying film and a method for fabricating the same. The present invention is characterized in that the method comprises: providing a substrate; forming, in sequence from substrate up, a transparent electrode, a luminescent layer, and an opposed electrode; and forming a drying film by providing a raw material composed of barium (Ba), magnesium (Mg) or calcium (Ca) to react with a gaseous reactant composed of oxygen on the surface of the opposed electrode. The drying film composed of barium oxide (BaO), magnesium oxide (MgO) or calcium oxide (CaO) can be employed to absorb the moisture. Therefore, the generation of dark spots can be prevented and the reliability of the device can be improved.

Abstract: The present invention discloses a white light emitting organic electroluminescent (EL) device and a method for fabricating the same. The device comprises: a substrate; an anode formed on the substrate; at least one hole transporting layer formed on the anode; at least one luminescent layer (DPVBi) formed on the hole transporting layer, wherein a first dopant (DCM2) is doped into the luminescent layer; at least one electron transporting layer formed on the luminescent layer, wherein a second dopant (C6) is doped into the electron transporting layer; and a cathode formed on the electron transporting layer; wherein a first light (red) is emitted by the first dopant, a second light (green) is emitted by the second dopant, and a third light (blue) is emitted by the luminescent layer when the device is applied with a bias voltage.