Abstract: A method a for controlling a distribution sequence for a semiconductor device includes: acquiring the quantity of all chambers and an actual working duration of each radio frequency device in the machines; providing an optimal working duration of the radio frequency device to calculate an average interval; sorting all the data to form a first queue data set, and obtaining a difference between adjacent data in the first queue data set; using a difference between adjacent consecutive data as a feature value corresponding to the former or latter data in the consecutive data, and using data that does not correspond to the difference as a feature value corresponding to the data; obtaining a second queue data set and a third queue data set; and obtaining a distribution sequence of distributing N batches of wafers to all the radio frequency devices.

Abstract: Embodiments of the present disclosure provide a method and a device for determining a fabrication chamber. According to a current radio frequency power time of each of the fabrication chambers corresponding to adjacent process steps and service phases divided based on a service period of the fabrication chambers, a service phase is determined for the current radio frequency power time of each of the fabrication chambers. For target objects processed by the fabrication chambers in the current process step, fabrication chambers for the target objects to enter in a next process step are directly determined according to the service phase of the current radio frequency power time of each of the fabrication chambers.

Abstract: The present disclosure provides a method and an apparatus of handling a control wafer, a method of testing by using a control wafer, a computer-readable storage medium and an electronic device, and relates to the technical field of semiconductor equipment. The method of handling a control wafer includes: setting different identification numbers for multiple reaction chambers; determining slot numbers of control wafers according to the identification numbers of the reaction chambers; and distributing the control wafers according to the slot numbers of the control wafers and the identification numbers of the reaction chambers.

Abstract: The present disclosure provides a method and an apparatus of handling a control wafer, a method of testing by using a control wafer, a computer-readable storage medium and an electronic device, and relates to the technical field of semiconductor equipment. The method of handling a control wafer includes: setting different identification numbers for multiple reaction chambers; determining slot numbers of control wafers according to the identification numbers of the reaction chambers; and distributing the control wafers according to the slot numbers of the control wafers and the identification numbers of the reaction chambers.