Patents by Inventor San-Chi Wang

San-Chi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8044525
    Abstract: The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: October 25, 2011
    Assignee: AU Optronics Corporation
    Inventor: San-Chi Wang
  • Publication number: 20100193974
    Abstract: The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
    Type: Application
    Filed: April 14, 2010
    Publication date: August 5, 2010
    Applicant: AU Optronics Corporation
    Inventor: San-Chi Wang
  • Patent number: 7727852
    Abstract: The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: June 1, 2010
    Assignee: AU Optronics Corporation
    Inventor: San-Chi Wang
  • Publication number: 20090267241
    Abstract: The invention relates to a substrate with a check mark and a method of inspecting position accuracy of conductive glue dispensed on the substrate. The method is implemented on the substrate having at least one transfer pad and at least one check mark arranged near the border of the transfer pad. After the conductive glue spot is dispensed on the transfer pad, the method includes first capturing an image by a video capturing element, then determining whether the conductive glue spot exist in the image and determining whether the conductive glue spot from the image matches a predetermined standard, if not, generating a report and a warning.
    Type: Application
    Filed: August 8, 2008
    Publication date: October 29, 2009
    Applicant: AU OPTRONICS CORPORATION
    Inventor: San-Chi Wang