Patents by Inventor San-Lien Yang

San-Lien Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070096917
    Abstract: A thermal transfer printing antenna RFID label by a thermal transfer printer includes mainly a conductive metal foil, a thermal transfer RFID antenna substratum and a RFID chip. A conductive metal foil is used as a material to thermal transfer the antenna circuits onto the substratum by a thermal transfer printer, forming the antenna substratum, which is then adhered with the RFID chip by a flip chip bonder or a wire bonder. The process can obtain a quick mass production and a lower cost for the label.
    Type: Application
    Filed: November 2, 2005
    Publication date: May 3, 2007
    Inventor: San-Lien Yang
  • Publication number: 20060187057
    Abstract: A RadioFrequency Identification module includes a radio frequency chip, an antenna substratum and a glued substratum. The antenna substratum has an antenna positioned thereon, with the radio frequency chip attached therein. The glued substratum has a glue cavity properly bored for dispensing epoxy therein. Then the glued substratum and the antenna substratum are adhered together with adhering glue to become a RadioFrequency Identification module, which is then embedded in a carton or the like as an identifying proof describing the content of the carton.
    Type: Application
    Filed: February 9, 2005
    Publication date: August 24, 2006
    Inventor: San-Lien Yang