Patents by Inventor San Liew

San Liew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Entire encapsulation of Cu interconnects using self-aligned CuSiN film
    Publication number: 20070197023
    Abstract: A method of forming a barrier layer and cap comprised of CuSiN for an interconnect. We provide an interconnect opening in a dielectric layer over a semiconductor structure. We form a CuSiN barrier layer over the sidewalls and bottom of the interconnect opening by reacting with the first copper layer. We then form an interconnect over the CuSiN layer filling the interconnect opening. We can form a CuSiN cap layer on the top surface of the interconnect.
    Type: Application
    Filed: February 22, 2006
    Publication date: August 23, 2007
    Inventors: Johnny Widodo, Bei Zhang, Tong Chen, Yong Siew, Fan Zhang, San Liew, John Sudijono, Liang Hsia