Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.

Abstract: A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed between the first and the second plurality of solder balls and configured to shield each solder ball of the first and second plurality of solder balls from electromagnetic interference.

Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes one or more ribbon bond connections along with one or more wire bond connections. In one example, ribbon bond connections are shown, and are coupled to ground, and configured to provide a shielding effect to wire bond connections.

Abstract: The present invention relates to a hard coating film including a substrate and a hard coating layer provided on at least one surface of the substrate, in which the hard coating layer includes a fluorine-based UV-curable-functional-group-containing compound, a conductive polymer, and a solvent, the conductive polymer being included in a specific amount, and the surface roughness (Ra) value of the hard coating layer is 1 nm or less, whereby the hard coating film can simultaneously exhibit hard coating performance and antifouling performance even in the form of a single layer not including a separate antifouling layer, and is remarkably improved in an antifouling effect based on the low surface roughness thereof due to the absence of inorganic fine particles, and the improved antifouling effect can be effectively maintained even in the presence of variously changing environmental conditions, and to a window and an image display device using the same.

Abstract: A hard coating film comprises a substrate, and a hard coating layer formed on at least one surface of the substrate, wherein the hard coating layer is formed from a hard coating composition comprising a hydroxyl group-containing light-transmitting resin, a fluorine-based UV-curable functional group-containing compound, a photoinitiator, and a solvent, and when measured by X-ray photoelectron spectroscopy (XPS) on a surface of the hard coating layer, atomic percent of elemental fluorine (F) on the surface of the hard coating layer is 10 to 55 at %. The hard coating film uses a hard coating composition including a hydroxyl group-containing light-transmitting resin and a fluorine-based UV-curable functional group-containing compound to control the atomic percent of the elemental fluorine (F) on the surface of the hard coating layer to a specific range, thereby providing excellent antifouling properties together with good wear resistance, scratch resistance, and bending resistance.

Abstract: According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.

Abstract: There may be provided a fastener arrangement. The fastener arrangement may include a first fastener tape including a first plurality of electrically conductive coupling elements and a first plurality of non-electrically conductive coupling elements. The fastener arrangement may further include a second fastener tape comprising a second plurality of electrically conductive coupling elements and a second plurality of non-electrically conductive coupling element. The fastener arrangement may further include a slider couplable to the first fastener tape and the second fastener tape for reversibly interleaving and interlocking the first plurality of electrically conductive and non-electrically conductive coupling elements with their corresponding second plurality of electrically conductive and non-electrically conductive elements.

Abstract: A flexible window stack structure includes a substrate, a first hard coating layer formed on a surface of the substrate and a second hard coating layer formed on an opposite surface of the substrate. The first hard coating layer has a curing contraction greater than that of the second hard coating layer, and the second hard coating layer is disposed at an elongated side when the window stack structure is folded. Cracks may be prevented by a curl property of the first hard coating layer when being bent.

Abstract: The present invention relates to a hard coating film including a substrate and a hard coating layer provided on at least one surface of the substrate, in which the hard coating layer includes a cured product of a hard coating composition containing a fluorine-based UV-curable-functional-group-containing compound, dendritic acrylate, a conductive polymer, and a solvent, the conductive polymer being included in a specific amount, whereby the hard coating film is applicable to a flexible display device and can simultaneously exhibit hard coating performance and antifouling performance even in the form of a single layer that does not include a separate antifouling layer, and in particular, the high antifouling effect can be maintained even in the presence of variously changing environmental conditions, and to a window and an image display device using the same.

Abstract: A hard coating film according to an embodiment includes a substrate layer, a first hard coating layer formed on the substrate layer and satisfying a predetermined elastic recovery rate, and a second hard coating layer formed on the first hard coating layer and satisfying a predetermined water contact angle. The hard coating film according to embodiments may provide improved press resistance, scratch resistance, and flexibility.

Abstract: The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

Abstract: A multilayer printed circuit board including a first printed circuit board portion, including a first inserting connector, including a plurality of contacts for creating a first removable bus connection; a second printed circuit board portion, including a second inserting connector, including a plurality of contacts for creating a second removable bus connection; a third printed circuit board portion, connected between the first printed circuit board portion and to the second printed circuit board portion, wherein a rigidity of the third printed circuit board portion is less than a rigidity of each of the first printed circuit board portion and the second printed circuit board portion; wherein the multilayer printed circuit board is foldable along the third printed circuit board portion and, if so folded, the first printed circuit board portion is arranged on top of the second printed circuit board portion.

Abstract: The present disclosure relates to a hard coating film capable of providing excellent durability, elastic recovery rate, and abrasion resistance, by including a base layer; a first hard coating layer formed on at least one surface of the base layer and including a fluorine-based UV-curable functional group-containing compound; and a second hard coating layer formed between the base layer and the first hard coating layer and including inorganic particles; and an image display device including the hard coating film.

Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.

Abstract: The present disclosure relates to a docking station including a triangular prism shaped body, and a cradle proximal to a top section of the triangular prism shaped body for detachably receiving a mobile device, wherein the cradle may include a plurality of different connection interfaces to provide a selectable connection with a complementary connection interface of the mobile device.

Abstract: According to the various examples, a dual display system having a first panel having a first display area, a second panel having a second display area, and a connector assembly, attached to the first and second panels, that is configured to enable the first and second panels to rotate around three-directional axes. The connector assembly includes an elongated member and a hinge assembly, which are configured for attachment to the first and second display panels. The present dual display system may have several functional modalities, including use as a desktop computer, a laptop computer, a tablet, and a panoramic display.

Abstract: An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.