Patents by Inventor San-Yuan Chung

San-Yuan Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulant module with opaque coating
    Patent number: 9350906
    Abstract: The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
    Type: Grant
    Filed: May 13, 2009
    Date of Patent: May 24, 2016
    Assignees: OMNIVISION TECHNOLOGIES, INC., VISERA TECHNOLOGIES COMPANY LIMITED
    Inventors: Shin-Chang Shiung, Chieh-Yuan Cheng, San-Yuan Chung
  • Image sensor device with opaque coating
    Patent number: 8854526
    Abstract: The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: October 7, 2014
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Shin-Chang Shiung, Chieh-Yuan Cheng, San-Yuan Chung
  • Lens modules and fabrication methods thereof
    Patent number: 8000041
    Abstract: According to an embodiment of the present invention, a lens module is provided, which includes a first lens assembly including a first patterned substrate, a first recess formed from a first surface of the first patterned substrate, a first lens element disposed in the first recess, and a second lens element disposed on the first patterned substrate, wherein the second lens element aligns along an optical axis through the first lens element.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: August 16, 2011
    Assignees: VisEra Technologies Company Limited, OmniVision Technologies, Inc.
    Inventors: Chien-Pang Lin, San-Yuan Chung, Weng-Chu Chu
  • LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATION THEREOF
    Publication number: 20100237378
    Abstract: An ultraviolet light emitting diode package structure is disclosed, comprising a substrate with a through-silicon via (TSV) disposed therein, a first electrode disposed on a top side of the substrate, and a second electrode disposed on a bottom side of the substrate, wherein the first electrode and the second electrode are electrically connected through the TSV, an ultraviolet light emitting diode bonded to the top side of the substrate, and a cover substrate bonded to the substrate, wherein the cover substrate comprises a cavity for receiving the ultraviolet light emitting diode.
    Type: Application
    Filed: March 19, 2009
    Publication date: September 23, 2010
    Inventors: Tzu-Han LIN, Wu-Cheng Kuo, San-Yuan Chung
  • IMAGE SENSOR DEVICE WITH OPAQUE COATING
    Publication number: 20100085465
    Abstract: The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Inventors: Shin-Chang SHIUNG, Chieh-Yuan Cheng, San-Yuan Chung
  • ENCAPSULANT MODULE WITH OPAQUE COATING
    Publication number: 20100085473
    Abstract: The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
    Type: Application
    Filed: May 13, 2009
    Publication date: April 8, 2010
    Inventors: Shin-Chang SHIUNG, Chieh-Yuan CHENG, San-Yuan CHUNG