Abstract: The present application proposes a display panel including a substrate including a display area and a non-display area surrounding the display area; a light-emitting layer located in the display area of the substrate; a groove obtained by exposing and developing the substrate, and disposed in the non-display area of the substrate and surrounding the display area; a thin-film encapsulation layer covering the light-emitting layer, and including an inorganic layer and an organic layer which are disposed alternately, wherein the organic layer is located in a region surrounded by the groove. The display panel has better bending resistance.

Abstract: The present application proposes a display panel including a substrate including a display area and a non-display area surrounding the display area; a light-emitting layer located in the display area of the substrate; a groove obtained by exposing and developing the substrate, and disposed in the non-display area of the substrate and surrounding the display area; a thin-film encapsulation layer covering the light-emitting layer, and including an inorganic layer and an organic layer which are disposed alternately, wherein the organic layer is located in a region surrounded by the groove. The display panel has better bending resistance.

Abstract: A method for fabricating an organic light emitting diode (OLED) display is provided. The fabricating method includes: forming a switch array layer on a base substrate; forming an organic light emitting display layer on the switch array layer; forming a thin film package layer on the organic light emitting display layer; and forming a superhydrophobic thin film on the thin film package layer using plasma chemical vapor deposition. The superhydrophobic thin film has a thickness smaller than a predetermined thickness.

Abstract: A method for fabricating an organic light emitting diode (OLED) display is provided. The fabricating method includes: forming a switch array layer on a base substrate; forming an organic light emitting display layer on the switch array layer; forming a thin film package layer on the organic light emitting display layer; and forming a superhydrophobic thin film on the thin film package layer using plasma chemical vapor deposition. The superhydrophobic thin film has a thickness smaller than a predetermined thickness.

Abstract: The present invention provides a display panel, an encapsulating method thereof and an electronic device, the electronic device comprising a display panel, the display panel comprising a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a light emitting layer disposed on a surface of the TFT layer; a seal layer disposed on the surface of the TFT layer; a first inorganic layer covering the light emitting layer, the seal layer, and the TFT layer; an organic layer disposed on a surface of the first inorganic layer; a second inorganic layer covering the organic layer, the first inorganic layer, and the TFT layer; wherein the material of the seal layer comprises an organic photosensitive material; and wherein two or more water absorbing particles are disposed in the seal layer, and the water absorbing particles are uniformly distributed in the organic photosensitive material.