Patents by Inventor Sa-Na Lee

Sa-Na Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for achieving uniform CU CMP polishing
    Patent number: 7153197
    Abstract: A method for removing a metal oxide overlayer over a target polishing surface in conjunction with a chemical mechanical polishing (CMP) process to improve polishing uniformity including providing a substrate target polishing surface having a layer of an oxide of a metal overlying said metal to be chemically mechanically polished; removing the layer of an oxide of the metal using an oxide removal solution prior to performing a CMP process with an abrasive slurry; and, polishing the target polishing surface according to an a CMP process with an abrasive slurry including at least one of an oxidizer and a complexing agent.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: December 26, 2006
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsu Shih, Sa-Na Lee, Syun-Ming Jang, Chi-Weng Chung