Patents by Inventor Sandeep A. Patel

Sandeep A. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10317952
    Abstract: An apparatus is provided which comprises: a chassis compartment having a bottom surface and walls orthogonal to the bottom, wherein the chassis compartment comprises: a rectangular opening, which may be designed to accept a microelectromechanical (MEMS) device and four slots, which may be designed to accept one or more magnet(s), extending outwardly from the rectangular opening, wherein each of the slots comprises: an inner opening having a length coextensive with a side of the rectangular opening, and an outer opening having corresponding ends that extend a length of the outer opening beyond the length of the inner opening. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: June 11, 2019
    Assignee: Intel Corporation
    Inventors: Sandeep S. Iyer, Amanuel Abebaw, Mark Saltas, Mayank Patel, Charavana K. Gurumurthy, Suriyakala Ramalingam, Vladimir Malamud
  • Patent number: 9871325
    Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: January 16, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Sandeep Patel, Bruce Allen Champion, Linda Ellen Shields, Michael John Phillips, Thomas Taake de Boer, John Joseph Consoli
  • Patent number: 9768557
    Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: September 19, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Michael John Phillips, Thomas Taake de Boer, Bruce Allen Champion, John Joseph Consoli, Sandeep Patel, Linda Ellen Shields
  • Patent number: 9748697
    Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: August 29, 2017
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS JAPAN G.K.
    Inventors: Sandeep Patel, Linda Ellen Shields, Bruce Allen Champion, Chad William Morgan, Masayuki Aizawa
  • Publication number: 20170207579
    Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.
    Type: Application
    Filed: January 15, 2016
    Publication date: July 20, 2017
    Inventors: Sandeep Patel, Bruce Allen Champion, Linda Ellen Shields, Michael John Phillips, Thomas Taake de Boer, John Joseph Consoli
  • Publication number: 20170170606
    Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.
    Type: Application
    Filed: December 14, 2015
    Publication date: June 15, 2017
    Inventors: Michael John Phillips, Thomas Taake de Boer, Bruce Allen Champion, John Joseph Consoli, Sandeep Patel, Linda Ellen Shields
  • Patent number: 9666998
    Abstract: A ground contact module includes a ground leadframe having a ground contact with a transition portion extending between mating and terminating ends. A ground dielectric body holds the ground leadframe. The ground dielectric body has a low loss layer overmolded over the ground leadframe. The ground dielectric body has a lossy band separate and discrete from the low loss layer and attached thereto in proximity to the ground contact such that the lossy band is electrically coupled to the ground contact. The lossy band is manufactured from lossy material having conductive particles in a dielectric binder material and absorbs electrical resonance propagating through the contact module stack.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: May 30, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Thomas Taake de Boer, Michael John Phillips, John Joseph Consoli, Sandeep Patel, Bruce Allen Champion, Linda Ellen Shields
  • Patent number: 9666990
    Abstract: A plug connector includes a plug body having a terminating end terminated to an electrical component and a mating end mated with a mating electrical connector. The plug body has first and second outer sides. The plug body has pockets between the first and second outer sides. A plug shroud extends from the plug body at the terminating end that is configured to be coupled to the electrical component. A contact array is held by the plug body and includes signal and ground contacts. The signal and ground contacts are exposed along the first and second outer sides. At least some of the ground contacts are aligned with corresponding pockets. Resonance-control lossy inserts are provided in corresponding pockets adjacent corresponding ground contacts. The lossy inserts are manufactured from lossy material capable of absorbing electrical resonance propagating through the plug body.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: May 30, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Thomas Taake de Boer, Michael John Phillips, John Joseph Consoli, Sandeep Patel, Bruce Allen Champion, Linda Ellen Shields
  • Patent number: 9590338
    Abstract: A rigid-flex circuit connector is provided that includes a layered circuit board and an array of electrical contacts. The layered circuit board has a rigid board stacked above a flex board. The rigid board includes at least one rigid substrate and a rigid board circuit. The rigid board circuit includes a plurality of conductive vias extending into the rigid board from a top surface of the rigid board. The flex board includes at least one flexible substrate and a flex board circuit. The flex board circuit electrically connects to the conductive vias of the rigid board circuit. The array of electrical contacts is loaded in the conductive vias. The electrical contacts have mating ends that protrude from the top surface of the rigid board to mechanically engage and electrically connect to mating contacts of a mating electronic component.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 7, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew Ryan Schmitt, Linda Ellen Shields, Randall R. Henry, Sandeep Patel, Mailoan Tran
  • Publication number: 20170018881
    Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.
    Type: Application
    Filed: July 14, 2015
    Publication date: January 19, 2017
    Inventors: Sandeep Patel, Linda Ellen Shields, Bruce Allen Champion, Chad William Morgan, Masayuki Aizawa
  • Patent number: 9531130
    Abstract: An electrical connector includes a housing having a mating housing and a contact organizer. The mating housing has a mating slot configured to receive a mating connector having contact pads. The contact organizer has signal and ground contact channels separated by separating walls with inner ends between the separating walls. The contact organizer has lossy fillers at the inner ends of the ground contact channels. The lossy fillers are manufactured from lossy material capable of absorbing electrical resonance propagating through the housing. The electrical connector includes a contact assembly disposed in the housing with ground contacts and signal contacts interspersed between corresponding ground contacts in corresponding ground and signal contact channels of the contact organizer. The ground contacts are positioned adjacent the lossy fillers at the inner ends of the corresponding ground contact channels.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: December 27, 2016
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: Michael John Phillips, Thomas Taake de Boer, Bruce Allen Champion, John Joseph Consoli, Sandeep Patel, Linda Ellen Shields
  • Patent number: 9490587
    Abstract: A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: November 8, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: Michael John Phillips, Thomas Taake de Boer, Bruce Allen Champion, John Joseph Consoli, Sandeep Patel, Linda Ellen Shields
  • Patent number: 9472900
    Abstract: An electrical connector includes a housing having a first end and a second end. The housing has a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A contact array is received in the housing. The contact array includes ground contacts and signal contacts interspersed between corresponding ground contacts. The ground contacts include attachment portions thereon. At least one lossy ground absorber is received in the housing and is coupled to at least one corresponding ground contact. Each lossy ground absorber includes at least one opening. The at least one opening receives the attachment portion of the corresponding ground contact.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: October 18, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: Michael John Phillips, Thomas Taake de Boer, Bruce Allen Champion, John Joseph Consoli, Sandeep Patel, Linda Ellen Shields
  • Patent number: 9455530
    Abstract: An electrical connector includes a housing having a front and a rear. The housing including a slot defined through the front that is configured to receive a mating connector therein. Signal contacts are held in the housing. The signal contacts are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and interspersed among the signal contacts. The ground contacts are arranged within the slot to mate with the mating connector. A ground bus includes a base and multiple sets of projections extending from the base. Each set including at least two projections that engage the same corresponding ground contact at spaced-apart locations. The sets of projections are connected via the base to create a ground circuit between the ground contacts that are engaged by the ground bus.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: September 27, 2016
    Assignee: Tyco Electronics Corporation
    Inventor: Sandeep Patel
  • Patent number: 9413112
    Abstract: An electrical connector includes a housing and a plurality of contact modules and ground plates held by the housing. Each contact module includes left and right signal wafers stacked next to each other along a stack axis. The signal wafers include electrical terminals held by a dielectric body. The electrical terminals have mounting contacts protruding from the dielectric body at a mounting face of the housing. The electrical terminals of at least one of the signal wafers in each contact module are jogged toward the other signal wafer such that the mounting contacts of each contact module align in a column. Each of the ground plates is disposed along an outer side of a corresponding contact module.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: August 9, 2016
    Assignee: Tyco Electronics Corporation
    Inventors: David Wayne Helster, Linda Ellen Shields, Michael John Phillips, Bruce Allen Champion, Sandeep Patel
  • Patent number: 9408335
    Abstract: An apparatus may be provided. The apparatus may comprise a circuit board. In addition, the apparatus may comprise an integrated connector mounted to the circuit board. A choke, external to the integrated connector, may be included in the apparatus. The choke may be electrically connected to the integrated connector through the circuit board.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: August 2, 2016
    Assignee: Cisco Technology, Inc.
    Inventors: William Frank Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep A. Patel, Keith Frank Tharp
  • Publication number: 20160043508
    Abstract: An electrical connector includes a housing and a plurality of contact modules and ground plates held by the housing. Each contact module includes left and right signal wafers stacked next to each other along a stack axis. The signal wafers include electrical terminals held by a dielectric body. The electrical terminals have mounting contacts protruding from the dielectric body at a mounting face of the housing. The electrical terminals of at least one of the signal wafers in each contact module are jogged toward the other signal wafer such that the mounting contacts of each contact module align in a column. Each of the ground plates is disposed along an outer side of a corresponding contact module.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 11, 2016
    Inventors: David Wayne Helster, Linda Ellen Shields, Michael John Phillips, Bruce Allen Champion, Sandeep Patel
  • Publication number: 20160006182
    Abstract: An electrical connector includes a housing having a front and a rear. The housing including a slot defined through the front that is configured to receive a mating connector therein. Signal contacts are held in the housing. The signal contacts are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and interspersed among the signal contacts. The ground contacts are arranged within the slot to mate with the mating connector. A ground bus includes a base and multiple sets of projections extending from the base. Each set including at least two projections that engage the same corresponding ground contact at spaced-apart locations. The sets of projections are connected via the base to create a ground circuit between the ground contacts that are engaged by the ground bus.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 7, 2016
    Inventor: Sandeep Patel
  • Publication number: 20150003032
    Abstract: An apparatus may be provided. The apparatus may comprise a circuit board. In addition, the apparatus may comprise an integrated connector mounted to the circuit board. A choke, external to the integrated connector, may be included in the apparatus. The choke may be electrically connected to the integrated connector through the circuit board.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: William Frank Edwards, George Edward Curtis, Ki Yuen Chau, Sandeep A. Patel, Keith Frank Tharp
  • Patent number: 8375230
    Abstract: According to certain embodiments, an apparatus comprises port interfaces, charge storage devices, and a charge combiner coupled to a circuit board. Each charge storage device is associated with a port interface. Each port interface receives a current of charge from a device under test and pumps the charge to an associated charge storage device at a predetermined rate. Each charge storage device stores the charge from an associated port interface. The charge combiner combines the charge from the charge storage devices to yield a combined charge and feeds the combined charge to an output regulator.
    Type: Grant
    Filed: May 20, 2010
    Date of Patent: February 12, 2013
    Assignee: Cisco Technology, Inc.
    Inventors: Christopher R. McMillan, Darren K. Hopcroft, Anoop Vetteth, Sandeep A. Patel, Francois J. Gautier-Le Boulch