Abstract: A flip chip package may include stacked vias in which the diameter D1 of the outermost via is less than the diameter D2 of the innermost via. The ratio D2/D1, for example, may be 1.5 to 2.

Abstract: A method of packaging a die includes reflowing the solder to electrically connect the die to a substrate at a first temperature, cooling the die and substrate to a second temperature, and placing a heated epoxy in contact with the die and the substrate. The method also includes holding the die and substrate at the second temperature for a time sufficient to allow the epoxy to cure, and cooling the die, substrate and epoxy. The second temperature is less than the first temperature. In addition, the die and substrate are not cooled to a temperature significantly below the second temperature until after the heated epoxy is placed in contact with the die and substrate.

Abstract: A method and an article made by a method for embedding optical fibers into an organic laminate structure. The optical fiber cabling, along with its cladding, is placed upon a first laminate layer that includes a composite made of silica fillers and a frictionless material such as polytetrafluoroethylene (PTFE). Then a second layer of PTFE material with silica fillers and copper sheeting is placed on top of the PTFE with silica fillers composite. The PTFE material with silica fillers flows about the optical fibers at a temperature approximately fifty degrees above the PTFE with silica fillers material's melting point. This procedure completely encases the optical fibers within an opaque sheath.