Abstract: The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding process using a patterned adhesive tape that reduces slurry seepage and adhesive contamination while also reducing the potential of electrostatic discharge damage. The patterned adhesive tape may comprise a base film and adhesive material patterned on the base film such that an edge or periphery portion of the microelectronic device substrate may contact the adhesive material, but substantially no adhesive material contacts interconnectors formed on the microelectronic device substrate. The base film of the patterned adhesive tape may have an electrically conductive coating or layer, or may be electrically conductive itself to reduce the potential of electrostatic discharge damage during the backgrinding process.