Abstract: This disclosure relates generally to sequential state elements (SSEs). More specifically, embodiments of flip-flops are disclosed, along with computerized methods and systems of designing the same. In one embodiment, the flip-flop includes a substrate and subcircuits that are formed on the substrate. The subcircuits provide subfunctions, wherein each of the subcircuits provides at least one of the subfunctions. More specifically, the subfunctions are provided in a sequential logical order by the subcircuits so that the flip-flop provides a flip-flop function. However, the subcircuits are interleaved out of the sequential logical order with respect to a corresponding subfunction provided by each of the subcircuits along a vector defined by the substrate. In this manner, interleaving the subcircuits along the vector of the substrate can provide separation between charge collection nodes without requiring increases in size. Thus, the flip-flop can be more compact and less expensive to manufacture.

Abstract: This disclosure relates generally to sequential state elements (SSEs). More specifically, embodiments of flip-flops are disclosed, along with computerized methods and systems of designing the same. In one embodiment, the flip-flop includes a substrate and subcircuits that are formed on the substrate. The subcircuits provide subfunctions, wherein each of the subcircuits provides at least one of the subfunctions. More specifically, the subfunctions are provided in a sequential logical order by the subcircuits so that the flip-flop provides a flip-flop function. However, the subcircuits are interleaved out of the sequential logical order with respect to a corresponding subfunction provided by each of the subcircuits along a vector defined by the substrate. In this manner, interleaving the subcircuits along the vector of the substrate can provide separation between charge collection nodes without requiring increases in size. Thus, the flip-flop can be more compact and less expensive to manufacture.