Patents by Inventor Sandeep Shantaram

Sandeep Shantaram has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged pressure sensor device
    Patent number: 11427464
    Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 30, 2022
    Assignee: NXP USA, Inc.
    Inventors: Weng Foong Yap, Jinbang Tang, Sandeep Shantaram
  • PACKAGED PRESSURE SENSOR DEVICE
    Publication number: 20210009405
    Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: Weng Foong Yap, Jinbang Tang, Sandeep Shantaram
  • Packaged pressure sensor device
    Patent number: 10822224
    Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: November 3, 2020
    Assignee: NXP USA, Inc.
    Inventors: Weng Foong Yap, Jinbang Tang, Sandeep Shantaram
  • PACKAGED PRESSURE SENSOR DEVICE
    Publication number: 20190112180
    Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 18, 2019
    Inventors: Weng Foong YAP, Jinbang Tang, Sandeep Shantaram