Patents by Inventor Sandeep Shrikant Tonapi
Sandeep Shrikant Tonapi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8048819Abstract: A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.Type: GrantFiled: June 23, 2005Date of Patent: November 1, 2011Assignee: Momentive Performance Materials Inc.Inventors: Slawomir Rubinsztajn, John Robert Campbell, Ryan Christopher Mills, Sandeep Shrikant Tonapi, Ananth Prabhakumar
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Patent number: 7797808Abstract: A method for making a thermal interface structure is provided. The method may include disposing a thermal transport layer on a resin layer to form a stacked structure, and slicing the stacked structure to form a cross-sectional slice having a first exposed portion of the thermal transport layer on a first surface of the slice, and a second exposed portion of the thermal transport layer on the second surface of the slice.Type: GrantFiled: October 11, 2005Date of Patent: September 21, 2010Assignee: General Electric CompanyInventors: Jian Zhang, Sandeep Shrikant Tonapi, Ryan Christopher Mills, Arun Virupaksha Gowda
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Publication number: 20090256254Abstract: A semiconductor assembly includes a semiconductor wafer including backside contact pads coupled to respective contact regions of different signal types and insulation separating the backside contact regions by signal type. The semiconductor assembly further includes metallization situated over at least a portion of the insulation and interconnecting the backside contact pads.Type: ApplicationFiled: April 10, 2008Publication date: October 15, 2009Applicant: GENERAL ELECTRIC COMPANYInventors: William Edward Burdick, JR., Jeffrey Scott Erlbaum, Kaustubh Ravindra Nagarkar, Sandeep Shrikant Tonapi
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Patent number: 7550097Abstract: Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.Type: GrantFiled: September 3, 2003Date of Patent: June 23, 2009Assignee: Momentive Performance Materials, Inc.Inventors: Sandeep Shrikant Tonapi, Hong Zhong, Davide Louis Simone, Raymond Albert Fillion
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Patent number: 7297399Abstract: A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.Type: GrantFiled: October 11, 2005Date of Patent: November 20, 2007Assignee: General Electric CompanyInventors: Jian Zhang, Sandeep Shrikant Tonapi, Ryan Christopher Mills, Arun Virupaksha Gowda
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Patent number: 7062008Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board.Type: GrantFiled: June 30, 2003Date of Patent: June 13, 2006Assignee: General Electric CompanyInventors: Ashutosh Joshi, William Edward Burdick, Jr., Sandeep Shrikant Tonapi, Joseph Lacey
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Patent number: 7022410Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.Type: GrantFiled: December 16, 2003Date of Patent: April 4, 2006Assignee: General Electric CompanyInventors: Sandeep Shrikant Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Slawomir Rubinsztajn
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Publication number: 20050181214Abstract: A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.Type: ApplicationFiled: December 7, 2004Publication date: August 18, 2005Inventors: John Robert Campbell, Slawomir Rubinsztajn, Florian Johannes Schattenmann, Sandeep Shrikant Tonapi, Ananth Prabhakumar, Wing-Keung Woo, Joseph Michael Anostario, Donna Marie Sherman
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Patent number: 6931092Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly.Type: GrantFiled: June 30, 2003Date of Patent: August 16, 2005Assignee: General Electric CompanyInventors: Ashutosh Joshi, William Edward Burdick, Jr., Sandeep Shrikant Tonapi, Joseph Lacey
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Publication number: 20050131106Abstract: A composition for use as underfill material is provided. The underfill material includes a first curable transparent resin composition and a second curable fluxing resin composition. The first curable resin composition includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds and combinations and mixtures thereof, thereby forming a solvent-modified resin. The second curable fluxing composition includes at least one epoxy resin. The combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.Type: ApplicationFiled: December 16, 2003Publication date: June 16, 2005Inventors: Sandeep Shrikant Tonapi, John Campbell, Ryan Mills, Ananth Prabhakumar, Slawomir Rubinsztajn
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Publication number: 20040264148Abstract: An electronic component assembly includes a flexible printed circuit, and further includes two components disposed on the flexible printed circuit, having electrical connections with the flexible printed circuit. The flexible layer is folded so that the components face each other and a thermal management device is disposed between the components. The thermal management device may be glued by a thermally conducting adhesive or otherwise held in a stable arrangement, in order to remove the heat generated from the components.Type: ApplicationFiled: June 27, 2003Publication date: December 30, 2004Inventors: William Edward Burdick, Sandeep Shrikant Tonapi, Joseph Alfred Iannotti, James Enrico Sabatini
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Publication number: 20040264631Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly.Type: ApplicationFiled: June 30, 2003Publication date: December 30, 2004Inventors: Ashutosh Joshi, William Edward Burdick, Sandeep Shrikant Tonapi, Joseph Lacey
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Publication number: 20040264632Abstract: A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object. A detector array comprises a plurality of detector assemblies. A gantry secured to the X-ray radiation source and the detector array rotates around a longitudinal axis. Further, each of the detector assembly comprises a detector subassembly adapted to detect the X-ray beams. These detector subassemblies are further adapted to convert the X-ray beams to a plurality of electrical signals. At least one circuit board assembly is coupled to the detector subassembly. The circuit board assembly typically comprises an integrated circuit array, such as, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array further comprises a plurality of integrated circuit chips, for example, data acquisition chips mounted on at least one printed circuit board.Type: ApplicationFiled: June 30, 2003Publication date: December 30, 2004Inventors: Ashutosh Joshi, William Edward Burdick, Sandeep Shrikant Tonapi, Joseph Lacey