Patents by Inventor Sandhya Sandireddy

Sandhya Sandireddy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabicating a microelectronic die having a curved surface
    Patent number: 7888188
    Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: February 15, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy
  • MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES
    Publication number: 20100062571
    Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
    Type: Application
    Filed: November 18, 2009
    Publication date: March 11, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Tongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy
  • Microelectronic devices having a curved surface and methods for manufacturing the same
    Patent number: 7633157
    Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: December 15, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy
  • Microelectronic devices and methods for manufacturing microelectronic devices
    Publication number: 20070132089
    Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a device includes a support member and a flexed microelectronic die mounted to the support member. The flexed microelectronic die has a plurality of terminals electrically coupled to the support member and an integrated circuit operably coupled to the terminals. The die can be a processor, memory, imager, or other suitable die. The support member can be a lead frame, a plurality of electrically conductive leads, and/or an interposer substrate.
    Type: Application
    Filed: December 13, 2005
    Publication date: June 14, 2007
    Inventors: Tongbi Jiang, Zhong-Yi Xia, Sandhya Sandireddy