Patents by Inventor Sandia You Ni Chiu

Sandia You Ni Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Data structures for semiconductor die packaging
    Patent number: 10658211
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: May 19, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas
  • Data Structures for Semiconductor Die Packaging
    Publication number: 20180350645
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Application
    Filed: August 7, 2018
    Publication date: December 6, 2018
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas
  • Data structures for semiconductor die packaging
    Patent number: 10068786
    Abstract: At least some embodiments are directed to a system that comprises storage comprising a data structure that cross-references an identifier of a semiconductor wafer, a location of a die in the wafer, an identifier of a lead frame strip, a location of a lead frame in the lead frame strip, and results of a first test on the die. The system also comprises mechanical equipment configured to test packaged die. The system further comprises a processor, coupled to the storage and to the mechanical equipment, configured to perform a second test on a package containing the die and the lead frame using the mechanical equipment and the results of the first test.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 4, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Joseph Anthony Boduch, Sandia You Ni Chiu, Robert Daniel Orr, Michael Francis Pas