Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. In embodiments, a semiconductor die having die bond pads along two adjacent edges may be electrically coupled to four sides of a four-sided leadframe. Embodiments relate to lead and no-lead type leadframe.

Abstract: A non-volatile storage system includes memory cells with floating gates that comprises three layers separated by two dielectric layers (an upper dielectric layer and lower dielectric layer). The dielectric layers may be an oxide layers, nitride layers, combinations of oxide and nitride, or some other suitable dielectric material. The lower dielectric layer is close to the bottom of the floating gate (near interface between floating gate and tunnel dielectric), while the upper dielectric layer is close to top of the floating gate (near interface between floating gate and inter-gate dielectric).

Abstract: A non-volatile storage system is disclosed that includes pairs of NAND strings (or other groupings of memory cells) in the same block being connected to and sharing a common bit line. To operate the system, two selection lines are used so that the NAND strings (or other groupings of memory cells) sharing a bit line can be selected at the block level. Both selection lines are connected to a selection gate for each of the NAND strings (or other groupings of memory cells) sharing the bit line. One set of embodiments avoid unwanted boosting during read operations by keeping the channels of the memory cells connected to word lines on the drain side of the selected word line biased at a fixed potential.

Abstract: Monolithic, three dimensional NAND strings include a semiconductor channel, at least one end portion of the semiconductor channel extending substantially perpendicular to a major surface of a substrate, a plurality of control gate electrodes having a strip shape extending substantially parallel to the major surface of the substrate, the blocking dielectric comprising a plurality of blocking dielectric segments, a plurality of discrete charge storage segments, and a tunnel dielectric located between each one of the plurality of the discrete charge storage segments and the semiconductor channel.

Abstract: A method includes, after data is stored at a data area of a memory device and error correction code (ECC) data corresponding to the data is stored at an ECC area corresponding to the data area, detecting a triggering condition. In response to detecting the triggering condition, the method also includes storing second ECC data in the ECC area, where the second ECC data includes redundant information for a first portion of the data area and storing third ECC data at the memory device. The third ECC data includes redundant information for a second portion of the data area.

Abstract: A lithography mask includes a plurality of patterning features formed on a mask substrate and a first plurality of sub-resolution assist features (SRAFs) formed substantially perpendicular to the patterning features on the mask substrate.

Abstract: A set of non-volatile storage elements are subjected to a programming process in order to store data. During the programming process, one or more verification operations are performed to determine whether the non-volatile storage elements have reached their target condition to store the appropriate data. Programming can be stopped when all non-volatile storage elements have reached their target level or when the number of non-volatile storage elements that have not reached their target level is less than a number or memory cells that can be corrected using an error correction process during a read operation (or other operation). The number of non-volatile storage elements that have not reached their target level can be estimated by counting the number of non-volatile storage elements that have not reached a condition that is different (e.g., lower) than the target level.