Patents by Inventor Sandra HEYDE

Sandra HEYDE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230313401
    Abstract: The invention relates to aqueous acidic plating baths for electrodeposition of copper and copper alloys in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises copper ions, at least one acid and an ureylene polymer. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 5, 2023
    Inventors: Heiko BRUNNER, Sandra HEYDE, Peter HAACK, Angela LLAVONA-SERRANO