Abstract: The present invention provides a method, structure, and system of beveling staggered card edges. In some embodiments, the method, computer program product, and system include receiving a card with a plug end and two or more metal contact leads running up to the plug end, removing material from the plug end such that one or more engagement points for one or more of the leads are set back from the plug end resulting in staggered steps, where an engagement point is where a metal contact lead will enter a receptacle, and removing material from an edge formed for each engagement point of the card such that beveled edges are created at the one or more engagement points for each lead.

Abstract: The present invention provides a method, structure, and system of beveling staggered card edges. In some embodiments, the method, computer program product, and system include receiving a card with a plug end and two or more metal contact leads running up to the plug end, removing material from the plug end such that one or more engagement points for one or more of the leads are set back from the plug end resulting in staggered steps, where an engagement point is where a metal contact lead will enter a receptacle, and removing material from an edge formed for each engagement point of the card such that beveled edges are created at the one or more engagement points for each lead.

Abstract: A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.