Patents by Inventor Sandra Vos

Sandra Vos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10820083
    Abstract: An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: October 27, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: John Szczech, Sandra Vos, William Ryan, Yu Du, Jose Salazar, Charles King
  • Publication number: 20190335262
    Abstract: An acoustic device including a motor disposed in a housing having a non-porous elastomeric membrane disposed across an acoustic path defined by a sound port of the housing is disclosed. The motor may be embodied as MEMS transducer configured to generate an electrical signal responsive to an acoustic signal, or as some other electromechanical device. The membrane has a compliance that is 1 to 100 times a compliance of the acoustic device without the membrane, wherein the membrane prevents ingress of contaminants (e.g., solids, liquids or light) via the sound port while permitting propagation of the acoustic signal along the acoustic path without significant loss.
    Type: Application
    Filed: April 24, 2019
    Publication date: October 31, 2019
    Applicant: KNOWLES ELECTRONICS, LLC
    Inventors: John Szczech, Sandra Vos, William Ryan, Yu Du, Jose Salazar, Charles King, Daniel Giesecke
  • Publication number: 20180020275
    Abstract: A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.
    Type: Application
    Filed: July 13, 2016
    Publication date: January 18, 2018
    Applicant: Knowles Electronics, LLC
    Inventors: Sung B. Lee, Wade Conklin, Michael Kuntzman, Sandra Vos
  • Patent number: 9860623
    Abstract: A microphone device comprises a base, a port formed in the base, a cover attached to the base that forms a housing interior with the base, an MEMS element disposed in the housing interior and on top of the port, and an integrated circuit stacked on top of the MEMS element. The MEMS element includes a diaphragm and a backplate opposing the diaphragm. The integrated circuit includes an active surface and a substrate supporting the active surface. Circuitry and/or connectors are formed on the active surface for processing signals produced by the MEMS element. The substrate faces the MEMS element.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: January 2, 2018
    Assignee: Knowles Electronics, LLC
    Inventors: Sung B. Lee, Wade Conklin, Michael Kuntzman, Sandra Vos
  • Publication number: 20140367810
    Abstract: An acoustic apparatus includes a substrate. A microelectromechanical system (MEMS) device is disposed on the substrate. The MEMS device forms a back volume between the MEMS device and the substrate. An integrated circuit disposed on the substrate. A cover is disposed on the substrate and the cover includes a port. The cover forms a cavity in which the MEMS device and the integrated circuit are disposed. The cover, substrate, MEMS device, and integrated circuit form a front volume. A filler material is disposed in the cavity to reduce an amount of the front volume that would exist in the absence of the filler material.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 18, 2014
    Inventors: Sandra Vos, John B. Szczech