Abstract: A capacitor assembly is presented, having a first to fourth individual capacitor each with a first top surface defining a respective normal direction of the individual capacitor and a second top surface opposite said first top surface, wherein the first top surface of the first individual capacitor defines a main direction, in each case first connection elements arranged on the first top surface and in each case second connection elements arranged on the second top surface, wherein the individual capacitors are arranged beside one another in a 2×2 matrix, wherein the normals of the first and second individual capacitor forming a first sub-assembly point in the main direction and wherein the normals of the third and fourth individual capacitor forming a second sub-assembly point opposite the main direction and wherein all the first connection elements are connected to one another by a first busbar and wherein all the second connection elements are connected to one another by a second busbar.

Abstract: A power electronic system is described, having a capacitor device and having a cooling device, wherein the cooling device has a first cooling contact surface with a normal direction, which is in direct thermal contact with the capacitor device, wherein the capacitor device has a first and a second element connecting device.

Abstract: An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Abstract: A power semiconductor arrangement has a switching facility, a housing, having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility. The housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible. A cover facility for covering the first opening is on the housing so as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates with the external second plug-in connecting facility, whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

Abstract: An electronic power converter is in a housing of a power converter arrangement. A cooling duct for cooling the power converter with a cooling liquid is inside the housing. The cooling duct has a connection supplying the cooling liquid to the cooling duct and for discharging. Mating connections are connected to the connections of the cooling duct. The connections and the mating connections have sealing surfaces which face each other. The interior of the housing and the cooling duct is sealed via sealing devices each have two sealing rings spaced apart from each other. First sealing rings seal the cooling duct and the other sealing rings seal the housing. Annular grooves as outflow ducts in the housing lead off and open out on the outside of the housing and are introduced into the sealing surfaces in the region between the sealing rings.

Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in theinially conducting contact with a cooling surface of the cooling device.

Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, and a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Abstract: The invention presents a power electronic arrangement comprising a power electronic switching device, a printed circuit board for carrying control signals for driving the power electronic switching device, a housing which covers the printed circuit board, a communication device which is arranged on the printed circuit board and is accessible through a recess in the housing, and comprising a sealing device, wherein the sealing device has a sealing section which rests in a sealing manner on a first sealing face of the communication device, and wherein the sealing device has a first and second sealing lip which are each arranged circumferentially around and at a distance from the communication device, wherein the two sealing lips are connected to one another by a web and both rest on a second sealing face of the printed circuit board, and wherein the housing has a wall-like pressure device which presses on the web and in this way the first sealing lip bears against that side of the pressure device which faces th

Abstract: The invention presents a power electronic arrangement comprising a power electronic switching device, a printed circuit board for carrying control signals for driving the power electronic switching device, a housing which covers the printed circuit board, a communication device which is arranged on the printed circuit board and is accessible through a recess in the housing, and comprising a sealing device, wherein the sealing device has a sealing section which rests in a sealing manner on a first sealing face of the communication device, and wherein the sealing device has a first and second sealing lip which are each arranged circumferentially around and at a distance from the communication device, wherein the two sealing lips are connected to one another by a web and both rest on a second sealing face of the printed circuit board, and wherein the housing has a wall-like pressure device which presses on the web and in this way the first sealing lip bears against that side of the pressure device which faces th