Patents by Inventor Sandy Chao
Sandy Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8536071Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: August 21, 2012Date of Patent: September 17, 2013Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin, Sandy Chao
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Patent number: 8419959Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.Type: GrantFiled: September 17, 2010Date of Patent: April 16, 2013Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao, Anthony de la Llera, Pratik Mankidy
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Publication number: 20130034967Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: August 21, 2012Publication date: February 7, 2013Inventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao
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Patent number: 8272346Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: GrantFiled: April 10, 2009Date of Patent: September 25, 2012Assignee: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng, Sandy Chao
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Patent number: 8084375Abstract: A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.Type: GrantFiled: November 2, 2010Date of Patent: December 27, 2011Assignee: Lam Research CorporationInventors: Akira Koshiishi, Sathya Mani, Gautam Bhattacharyya, Gregory R. Bettencourt, Sandy Chao
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Publication number: 20110104884Abstract: A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.Type: ApplicationFiled: November 2, 2010Publication date: May 5, 2011Applicant: Lam Research CorporationInventors: Akira Koshiishi, Sathya Mani, Gautam Bhattacharyya, Gregory R. Bettencourt, Sandy Chao
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Publication number: 20110070740Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.Type: ApplicationFiled: September 17, 2010Publication date: March 24, 2011Applicant: Lam Research CorporationInventors: Gregory R. Bettencourt, Gautam Bhattacharyya, Simon Gosselin Eng., Sandy Chao, Anthony de la Llera, Pratik Mankidy
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Publication number: 20100261354Abstract: An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A thermally and electrically conductive gasket with projections thereon is compressed between the showerhead electrode and the backing plate at a location three to four inches from the center of the showerhead electrode. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.Type: ApplicationFiled: April 10, 2009Publication date: October 14, 2010Applicant: Lam Research CorporationInventors: GREGORY R. BETTENCOURT, Gautam Bhattacharyya, Simon Gosselin Eng, Sandy Chao
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Publication number: 20060264160Abstract: In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.Type: ApplicationFiled: July 31, 2006Publication date: November 23, 2006Inventors: Sandy Chao, Songjae Lee, Ho Shin
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Publication number: 20060207671Abstract: In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.Type: ApplicationFiled: May 23, 2006Publication date: September 21, 2006Inventors: Sandy Chao, Songjae Lee, Ho Shin
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Publication number: 20050284528Abstract: In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.Type: ApplicationFiled: January 28, 2005Publication date: December 29, 2005Inventors: Sandy Chao, Songjae Lee, Ho Shin