Abstract: A module component includes a substrate having a first principal surface, a semiconductor substrate disposed on the first principal surface of the substrate, multiple terminals, and a resin layer. The terminals include multiple reference-potential terminals, which are electrically connected to the reference potential, and multiple signal terminals, which are disposed adjacent to at least one of the reference-potential terminals in the direction along an end portion of the substrate and which are supplied with a signal. In a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the reference-potential terminals, the support portion is disposed between an end surface of the connection portion and the end portion of the substrate, and, in at least one of the signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.

Abstract: The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.

Abstract: A support has a first surface and a second surface, and directions of normal vectors of the first surface and the second surface pointing outside are different from each other. A first antenna is provided on the first surface, and a second antenna is provided on a second surface. A radio frequency signal received at the first antenna is transmitted through a transmission line to the second antenna, and a radio frequency signal received at the second antenna is transmitted through the transmission line to the first antenna. The first antenna, the second antenna, and the transmission line are configured such that the directivity of the first antenna is different from the directivity of the second antenna.

Abstract: A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

Abstract: A module component includes a substrate having a first principal surface, a semiconductor substrate disposed on the first principal surface of the substrate, multiple terminals, and a resin layer. The terminals include multiple reference-potential terminals, which are electrically connected to the reference potential, and multiple signal terminals, which are disposed adjacent to at least one of the reference-potential terminals in the direction along an end portion of the substrate and which are supplied with a signal. In a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the reference-potential terminals, the support portion is disposed between an end surface of the connection portion and the end portion of the substrate, and, in at least one of the signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.

Abstract: A support has a first surface and a second surface, and directions of normal vectors of the first surface and the second surface pointing outside are different from each other. A first antenna is provided on the first surface, and a second antenna is provided on a second surface. A radio frequency signal received at the first antenna is transmitted through a transmission line to the second antenna, and a radio frequency signal received at the second antenna is transmitted through the transmission line to the first antenna. The first antenna, the second antenna, and the transmission line are configured such that the directivity of the first antenna is different from the directivity of the second antenna.

Abstract: An antenna module (100) includes a dielectric substrate (160) having a multilayer structure, a first radiation electrode (122), a second radiation electrode (121), and a ground electrode (GND). The second radiation electrode (121) is arranged between the first radiation electrode (122) and the ground electrode (GND) in a lamination direction of the dielectric substrate (160). In the dielectric substrate (160), a hollow portion (150) is disposed in at least a portion between the first radiation electrode (122) and the second radiation electrode (121).

Abstract: An antenna module (10) includes a dielectric substrate (110), patch antennas (100) that are disposed at locations near a first main surface of the dielectric substrate (110), a RFIC (30) that is mounted at a location near a second main surface of the dielectric substrate (110) opposite the first main surface and that is electrically connected to the patch antennas (100), and an identification mark (50) that is located in an antenna arrangement area that is an area of the dielectric substrate (110) except for an outer circumferential area in which the patch antennas (100) are not arranged. The identification mark (50) is located in the antenna arrangement area so as not to overlap feed points (115) with which the respective patch antennas (100) are provided in a plan view of the first main surface.

Abstract: A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

Abstract: The present disclosure improves, in an antenna module, the isolation characteristic between an output signal from an antenna and an input signal. An antenna module includes a dielectric substrate having a first surface and a second surface, an antenna formed on the first surface, a radio frequency element configured to supply a radio frequency signal to the antenna, and a signal terminal formed into a columnar shape using a conductive material. The signal terminal is connected to the radio frequency element by a wiring pattern in the dielectric substrate. The signal terminal is disposed outside an excitation region generated in an excitation direction of an output signal.

Abstract: A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

Abstract: The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.

Abstract: A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.

Abstract: An antenna module (10) includes a dielectric substrate (110), patch antennas (100) that are disposed at locations near a first main surface of the dielectric substrate (110), a RFIC (30) that is mounted at a location near a second main surface of the dielectric substrate (110) opposite the first main surface and that is electrically connected to the patch antennas (100), and an identification mark (50) that is located in an antenna arrangement area that is an area of the dielectric substrate (110) except for an outer circumferential area in which the patch antennas (100) are not arranged. The identification mark (50) is located in the antenna arrangement area so as not to overlap feed points (115) with which the respective patch antennas (100) are provided in a plan view of the first main surface.

Abstract: Provided is a low-noise amplifier that can effectively suppress noise included in an input signal. A low-noise amplifier according to an embodiment of the present invention amplifies a reception signal in a predetermined frequency band from an antenna. The low-noise amplifier includes an input terminal, an output terminal, a field effect transistor, and a branch circuit. The branch circuit is branched from a circuit connecting the input terminal or the output terminal to the field effect transistor. The branch circuit is connected to the elastic wave resonator.

Abstract: The present disclosure improves, in an antenna module, the isolation characteristic between an output signal from an antenna and an input signal. An antenna module includes a dielectric substrate having a first surface and a second surface, an antenna formed on the first surface, a radio frequency element configured to supply a radio frequency signal to the antenna, and a signal terminal formed into a columnar shape using a conductive material. The signal terminal is connected to the radio frequency element by a wiring pattern in the dielectric substrate. The signal terminal is disposed outside an excitation region generated in an excitation direction of an output signal.

Abstract: A high-frequency front end circuit includes a duplexer, a phase adjustment circuit, and a power amplifier. The phase adjustment circuit is connected between the power amplifier and a transmission filter of the duplexer. The phase adjustment circuit carries out phase adjustment so that a quadrant in which an impedance ZRX (fr0) seen from the transmission filter toward the power amplifier at the fundamental frequency of a reception signal is present and a quadrant in which an impedance ZTX (fr0) seen from the power amplifier toward the transmission filter at the fundamental frequency of the reception signal is present are not in a conjugate relationship with respect to the phase.

Abstract: A radio frequency front-end circuit includes a duplexer, a phase adjustment circuit, and a low noise amplifier. The phase adjustment circuit is connected between an Rx filter of the duplexer and the low noise amplifier. The phase adjustment circuit executes phase adjustment such that a quadrant in which an impedance ZLNA(fn) at a particular frequency different from a fundamental frequency of a reception signal when looking at the low noise amplifier side from the Rx filter is present and a quadrant in which an impedance ZRX(fn) at the particular frequency when looking at the Rx filter side from the low noise amplifier is present are not in a conjugate relation in terms of phase.

Abstract: Provided is a low-noise amplifier that can effectively suppress noise included in an input signal. A low-noise amplifier according to an embodiment of the present invention amplifies a reception signal in a predetermined frequency band from an antenna. The low-noise amplifier includes an input terminal, an output terminal, a field effect transistor, and a branch circuit. The branch circuit is branched from a circuit connecting the input terminal or the output terminal to the field effect transistor. The branch circuit is connected to the elastic wave resonator.

Abstract: A radio frequency front-end circuit includes a duplexer, a phase adjustment circuit, and a low noise amplifier. The phase adjustment circuit is connected between an Rx filter of the duplexer and the low noise amplifier. The phase adjustment circuit executes phase adjustment such that a quadrant in which an impedance ZLNA(fn) at a particular frequency different from a fundamental frequency of a reception signal when looking at the low noise amplifier side from the Rx filter is present and a quadrant in which an impedance ZRX(fn) at the particular frequency when looking at the Rx filter side from the low noise amplifier is present are not in a conjugate relation in terms of phase.