Abstract: A tunnel diode is disclosed having a highly P-doped layer of indium gallium arsenide formed on a highly N-doped layer of indium gallium arsenide which is supported on a semi-insulating substrate of indium phosphide. In an alternative embodiment, a tunnel diode is disclosed which has a highly P-doped layer of indium gallium arsenide formed on a highly N-doped layer of indium gallium arsenide which is supported on an N-doped substrate.

Abstract: A tunnel diode is disclosed having a highly P-doped layer of indium gallium arsenide formed on a highly N-doped layer of indium gallium arsenide which is supported on a semi-insulating substrate of indium phosphide. In an alternative embodiment, a tunnel diode is disclosed which has a highly P-doped layer of indium gallium arsenide formed on a highly N-doped layer of indium gallium arsenide which is supported on an N-doped substrate.

Abstract: Disclosed is a process for producing a monolithic microwave integrated circuit device utilizing a body having a first thickness in the heat producing region and a second thickness in the region adjacent to the microstrip transmission lines.

Abstract: Disclosed is a tunable circuit for an integrated circuit device and a process for making such circuit.

Abstract: This disclosure depicts a novel semiconductor device and the method of making it. A novel field effect transistor (FET) has a channel region which is heavily doped under the gate and between the gate and the source of the FET. The channel region between the gate and the drain is lightly doped. The FET is formed on a heavily doped semiconductor substrate. The method of making the novel FET comprises providing a mask layer over a lightly doped channel region and forming openings in the mask layer such that a portion of the mask is located at the gate location and has a predetermined width and height.

Abstract: Disclosed is a process for attaching a die to a package, which process utilizes a heat cycle in conjunction with a vacuum in the attachment process.

Abstract: Disclosed is a process for producing a field effect transistor to provide a uniformity of spacing between the gate and drain as well as the gate and source.

Abstract: This disclosure depicts a novel semiconductor device and the method of making it. A novel field effect transistor (FET) has a channel region which is heavily doped under the gate and between the gate and the source of the FET. The channel region between the gate and the drain is lightly doped. The FET is formed on a heavily doped semiconductor substrate. The method of making the novel FET comprises providing a mask layer over a lightly doped channel region and forming openings in the mask layer such that a portion of the mask is located at the gate location and has a predetermined width and height. Ion implanting is performed at a predetermined angle such that a first portion of the channel adjacent the source is heavily doped and a second portion of the channel adjacent the drain is not exposed due to the height of the mask at the gate.