Patents by Inventor Sang-Bong Lee

Sang-Bong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6529557
    Abstract: A high-speed add-compare selection apparatus, for a Viterbi algorithm processing apparatus having a branch metric calculator and a metric memory, is described. First and second previous metric values are supplied from the metric memory to first and second registers. The first previous metric value from the first register and a branch metric value of the present state calculated by the branch metric calculator are added, as are the second previous metric value from the second register and a branch metric value of the next state calculated by the branch metric calculator. The values obtained are compared and a survival metric value calculated accordingly.
    Type: Grant
    Filed: March 17, 1999
    Date of Patent: March 4, 2003
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Sang-Bong Lee
  • Patent number: 6133383
    Abstract: A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a quinoxalinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.
    Type: Grant
    Filed: October 28, 1997
    Date of Patent: October 17, 2000
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Jae-Rock Lee, Soo-Jin Park, Sang-Bong Lee
  • Patent number: 6121405
    Abstract: A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a pyrazinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: September 19, 2000
    Assignee: Korea Research Institute of Chemical Technology
    Inventors: Jae-Rock Lee, Soon-Jin Park, Sang-Bong Lee, Kyu-Wan Lee
  • Patent number: 6034200
    Abstract: A heat-curable resin composition comprising a multifunctional epoxy resin monomer and a heat-latent curing agent of formula (I) provides a cured epoxy resin having good thermal and dimensional stability: ##STR1## wherein: R is hydrogen, a C.sub.1-4 alkyl or C.sub.1-4 alkoxy group.
    Type: Grant
    Filed: March 17, 1998
    Date of Patent: March 7, 2000
    Assignee: Korea Research Institute of Chemical Tech.
    Inventors: Jae-Rock Lee, Soo-Jin Park, Sang-Bong Lee