Patents by Inventor Sang-chae Kim

Sang-chae Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970090
    Abstract: A railess variable seatback type rear seat includes: a linear movement device configured to convert a rotation of a motor into a linear movement; a sliding movement device configured to convert the linear movement into a sliding movement in which a seat cushion is pushed forward or backward; and a reclining angle change device configured to convert the sliding movement into a reclining movement, and to fold a seatback, which is connected to the seat cushion, forward or to recline the seatback backward.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 30, 2024
    Assignees: HYUNDAI MOTOR COMPANY, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Seung-Hyun Kim, Sang-Hyun Lee, Min-Ju Lee, Byung-Yong Choi, Chan-Ho Jung, Seon-Chae Na, Young-Woon Choi, Jae-Jin Lee, Dong-Hwan Kim, In-Chang Hwang
  • Patent number: 7281304
    Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) includes depositing a dielectric layer on a substrate, providing a sacrificial layer on part of the dielectric layer; providing a bottom electrode on part of the sacrificial layer on part of the dielectric layer; providing a piezoelectric layer on the bottom electrode; patterning a top electrode on the piezoelectric layer; and removing the sacrificial layer. The substrate may have a cavity receiving the sacrificial layer. As a result, a cantilevered resonator having an air gap between the bottom electrode and the dielectric layer may be simply fabricated.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: October 16, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-chae Kim, In-sang Song, Young-tack Hong
  • Patent number: 7185968
    Abstract: An ink-jet printhead package includes a frame having a first surface and a second surface with a hollow and an ink supply hole, the hollow and the ink supply hole extending through the frame, the ink supply hole providing flow communication between the first surface and the second surface, a groove formed on the second surface of the frame, the groove surrounding the hollow and the ink supply hole, an adhesive coating an interior of the groove, and a printhead chip having a first surface and a second surface, the first surface of the printhead chip having a plurality of nozzles formed thereon and the second surface of the printhead chip being adhered to the frame by the adhesive, the printhead chip being operable to eject ink supplied through the ink supply hole through the plurality of nozzles.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: March 6, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-chae Kim, Jae-woo Chung, Seung-mo Lim
  • Publication number: 20060051248
    Abstract: Disclosed is a microfluidic bio sample processing apparatus including a processing module configured for processing the bio sample and having a hole through which the processed bio sample, a solution for processing the bio sample or both flow, a board having a flowing channel connected with the hole so as to allow the bio sample, the solution for processing the bio sample or both to flow between processing modules and a bonding feature for bonding the processing module with the board. The processing modules are configured to be assembled and/or disassembled onto or from the board so that the processing apparatus is adapted to various kinds of bio samples having different processing steps.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 9, 2006
    Inventors: Hye-jung Cho, Jeong-gun Lee, Sang-Kyun Kang, Sang-chae Kim, Tae-gyun Kim, Jae-yong Lee
  • Patent number: 6986609
    Abstract: An optical module, in which one or more grooves on which a plurality of optical fibers or optical parts are mounted, are formed to different depths and a stopper hole is manufactured so as to prevent a convex corner phenomenon so that an optical axis is precisely aligned, and a method of manufacturing the same are provided. The method of manufacturing an optical module includes the steps of first etching to form one or more grooves on a first surface of a wafer, and second etching to form one or more stopper holes so that a second surface of the wafer is etched to penetrate the wafer. The optical module having one or more grooves for mounting one or more optical parts on a substrate, includes stopper holes which are formed by penetrating the bottom surface of the substrate to center a region which corresponds to a predetermined region among the grooves.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: January 17, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-chae Kim, Hyung Choi, Yong-sung Kim
  • Publication number: 20050034822
    Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) includes depositing a dielectric layer on a substrate, providing a sacrificial layer on part of the dielectric layer; providing a bottom electrode on part of the sacrificial layer on part of the dielectric layer; providing a piezoelectric layer on the bottom electrode; patterning a top electrode on the piezoelectric layer; and removing the sacrificial layer. The substrate may have a cavity receiving the sacrificial layer. As a result, a cantilevered resonator having an air gap between the bottom electrode and the dielectric layer may be simply fabricated.
    Type: Application
    Filed: April 20, 2004
    Publication date: February 17, 2005
    Inventors: Sang-chae Kim, In-sang Song, Young-tack Hong
  • Publication number: 20050012775
    Abstract: An ink-jet printhead package includes a frame having a first surface and a second surface with a hollow and an ink supply hole, the hollow and the ink supply hole extending through the frame, the ink supply hole providing flow communication between the first surface and the second surface, a groove formed on the second surface of the frame, the groove surrounding the hollow and the ink supply hole, an adhesive coating an interior of the groove, and a printhead chip having a first surface and a second surface, the first surface of the printhead chip having a plurality of nozzles formed thereon and the second surface of the printhead chip being adhered to the frame by the adhesive, the printhead chip being operable to eject ink supplied through the ink supply hole through the plurality of nozzles.
    Type: Application
    Filed: April 28, 2004
    Publication date: January 20, 2005
    Inventors: Sang-chae Kim, Jae-woo Chung, Seung-mo Lim
  • Publication number: 20020172474
    Abstract: An optical module, in which one or more grooves on which a plurality of optical fibers or optical parts are mounted, are formed to different depths and a stopper hole is manufactured so as to prevent a convex corner phenomenon so that an optical axis is precisely aligned, and a method for manufacturing the same are provided. The method for manufacturing an optical module includes the steps of first etching to form one or more grooves on a first surface of a wafer, and second etching to form one or more stopper holes so that a second surface of the wafer is etched to penetrate the wafer. The optical module having one or more grooves for mounting one or more optical parts on a substrate, includes stopper holes which are formed by penetrating the bottom surface of the substrate to center a region which corresponds to a predetermined region among the grooves.
    Type: Application
    Filed: May 6, 2002
    Publication date: November 21, 2002
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Chae Kim, Hyung Choi, Yong-Sung Kim