Patents by Inventor Sang-cheol Ko

Sang-cheol Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050193557
    Abstract: A method of fabricating an ink-jet print head includes at least one process of forming an ink feeding port. The ink feeding port forming process comprises fixing a wafer to a stage in a chamber, and processing the ink feeding port to a desired depth in the wafer using a liquid-jet guided laser. In addition, the method of fabricating the ink-jet print head includes a process of dicing a wafer in order to cut the wafer in the form of chips. The wafer dicing process comprises fixing the wafer to a stage in a chamber, and dicing the wafer using a liquid-jet guided laser. According to the present invention, the liquid-jet guided laser that combines laser and a micro liquid-jet is used when forming an ink-feeding port of a print head and/or when dicing the wafer formed with a plurality of print heads, whereby it is possible to achieve effects that a thermal damage of the print heads can be prevented, process costs can be saved, and a process time can be reduced.
    Type: Application
    Filed: March 3, 2004
    Publication date: September 8, 2005
    Inventors: Sang-cheol Ko, Kwang-ryul Kim
  • Publication number: 20040104967
    Abstract: An ink-jet printhead comprising a substrate which includes an ink chamber where ink is stored, nozzles through which ink in the ink chamber is ejected, and a plurality of pads which apply an electrical signal to generate droplets in the ink chamber, a flexible printed circuit (FPC) cable which includes a conductor corresponding to each of the pads, each conductor having bonding portions at front ends thereof, and connection members which electrically connect the pads to the bonding portions.
    Type: Application
    Filed: July 11, 2003
    Publication date: June 3, 2004
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang-ryul Kim, Sang-cheol Ko, Jong-suk Seo
  • Patent number: 6702428
    Abstract: A bubble-jet type ink-jet printhead has a structure in which a base plate, a barrier wall, and a nozzle plate are stacked. The base plate includes a substrate on which a recess is formed to a predetermined depth, an adiabatic layer formed on the substrate, a heater which is formed on the adiabatic layer and generates a thermal energy, and a passivation layer which is formed on the heater and passivates the heater. The barrier wall is stacked on the base plate, defines an ink chamber, which is disposed on the recess and has a recessed bottom surface, and defines an ink passage which communicates with the ink chamber. The nozzle plate is stacked on the barrier wall, has nozzles through which ink is ejected, and is formed at a location corresponding to a center of the ink chamber.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: March 9, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-joon Park, Seo-hyun Cho, Sang-cheol Ko, Jae-sik Min, Kyong-il Kim, Byung-ha Park, Tae-kyun Kim, Myung-song Jung
  • Publication number: 20030081076
    Abstract: A bubble-jet type ink-jet printhead has a structure in which a base plate, a barrier wall, and a nozzle plate are stacked. The base plate includes a substrate on which a recess is formed to a predetermined depth, an adiabatic layer formed on the substrate, a heater which is formed on the adiabatic layer and generates a thermal energy, and a passivation layer which is formed on the heater and passivates the heater. The barrier wall is stacked on the base plate, defines an ink chamber, which is disposed on the recess and has a recessed bottom surface, and defines an ink passage which communicates with the ink chamber. The nozzle plate is stacked on the barrier wall, has nozzles through which ink is ejected, and is formed at a location corresponding to a center of the ink chamber.
    Type: Application
    Filed: October 10, 2002
    Publication date: May 1, 2003
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-joon Park, Seo-hyun Cho, Sang-cheol Ko, Jae-sik Min, Kyong-il Kim, Byung-ha Park, Tae-kyun Kim, Myung-song Jung