Patents by Inventor Sang Cheon Park

Sang Cheon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10904766
    Abstract: Provided is a method of determining a node location in a cognitive radio network environment in which data is transmitted from a first node to a third node via a second node. The method includes information requesting wherein the first node transmits an information request signal to a plurality of second nodes in a preset segmented region; information receiving wherein the first node receives, from the second nodes, location information and frequency resource information for each second node corresponding to the transmitted information request signal; and segment determining wherein the first node determines one segment in the segmented region based on the received location information and frequency resource information.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: January 26, 2021
    Assignee: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Sang Cheon Park, Young Taek Hong, Jee Min Kim, Seong Lyun Kim
  • Publication number: 20200077274
    Abstract: Provided is a method of determining a node location in a cognitive radio network environment in which data is transmitted from a first node to a third node via a second node. The method includes information requesting wherein the first node transmits an information request signal to a plurality of second nodes in a preset segmented region; information receiving wherein the first node receives, from the second nodes, location information and frequency resource information for each second node corresponding to the transmitted information request signal; and segment determining wherein the first node determines one segment in the segmented region based on the received location information and frequency resource information.
    Type: Application
    Filed: August 20, 2018
    Publication date: March 5, 2020
    Inventors: Sang Cheon PARK, Young Taek HONG, Jee Min KIM, Seong Lyun KIM
  • Publication number: 20200016698
    Abstract: A filler wire may include a rod including an aluminum-silicon (Al—Si) alloy powder and a fluoride flux powder, and a sheath including zinc (Zn) alloy and surrounding the rod.
    Type: Application
    Filed: June 17, 2019
    Publication date: January 16, 2020
    Inventor: Sang-Cheon Park
  • Patent number: 10197820
    Abstract: Provided are quantum dots passivated by oligomers or polymers which are formed by a reaction of a first monomer having at least three thiol groups (—SH) at the terminal end with a second monomer having at least two functional groups at the terminal end that can react with the thiol groups, and a spacer group between the at least two functional groups.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jinsuop Youn, Obum Kwon, Jun Woo Lee, Euihyun Kong, Jonggi Kim, Sang Cheon Park, Onyou Park, Heeje Woo, Sungseo Cho, Hyunjoo Han
  • Patent number: 10189203
    Abstract: Provided is a method for forming a pattern of polyimide that is simpler and is more excellent in the pattern shape and in the dimensional accuracy in comparison with the conventional techniques of patterning polyimide, such as photolithography and laser processing. In a method for forming a micropattern of polyimide, which includes using as polyimide a solvent-soluble polyimide resin composition that is photosensitive and is moldable at a temperature of less than or equal to a glass-transition temperature; patterning the composition using thermal imprinting; and thermally curing the composition, ultraviolet irradiation is performed after the composition is released from a mold after a molding step.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: January 29, 2019
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Sung Won Youn, Sang Cheon Park, Hiroshi Hiroshima, Hideki Takagi, Kenta Suzuki
  • Patent number: 10121731
    Abstract: A semiconductor device includes a semiconductor chip having an active surface and a non-active surface opposite to the active surface, an upper insulating layer provided on the non-active surface of semiconductor chip, and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively. The connection pad has a first surface exposed outside the upper insulating layer and a second surface opposite to the first surface and facing the semiconductor chip. The first surface of the connection pad is coplanar with an upper surface of the upper insulating layer.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Cheon Park, Won Il Lee, Chajea Jo, Taeje Cho
  • Patent number: 10030281
    Abstract: Disclosed are a steel pipe having a three-layer structure and a manufacturing method thereof. The steel pipe includes a three-layer structure of bainite and martensite, which are formed by high-frequency induction heating thereby improving toughness to enhance crash performance of a vehicle. The steel pipe includes a bainite structure layer, a bainite and martensite dual-phase structure layer, and a martensite structure layer.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: July 24, 2018
    Assignee: Hyundai Motor Company
    Inventor: Sang-Cheon Park
  • Patent number: 10018792
    Abstract: Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: July 10, 2018
    Assignee: KMW U.S.A., Inc.
    Inventors: Byung In Kim, Sang Cheon Park
  • Patent number: 10007139
    Abstract: A liquid crystal display module includes first and second polarizing plates, and a liquid crystal panel between the polarizing plates. The second polarizing plate comprises an optical film on a polarizer. The optical film comprises a high refractive index pattern layer having at least one engraved pattern, and a low refractive index pattern layer having a filling pattern that fills at least a portion of the engraved pattern. The high refractive index pattern layer has a higher refractive index than the low refractive index pattern layer. The optical film is disposed such that light emitted from the liquid crystal panel will enter the low refractive index pattern layer and then be emitted through the high refractive index pattern layer. A liquid crystal display includes the liquid crystal display module.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: June 26, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Young Oh, Seong Hoon Lee, Jeong Ho Lee, Young Hyun Ju, Sang Cheon Park
  • Publication number: 20180059442
    Abstract: Provided are quantum dots passivated by oligomers or polymers which are formed by a reaction of a first monomer having at least three thiol groups (—SH) at the terminal end with a second monomer having at least two functional groups at the terminal end that can react with the thiol groups, and a spacer group between the at least two functional groups.
    Type: Application
    Filed: December 4, 2015
    Publication date: March 1, 2018
    Inventors: Jinsuop YOUN, Obum KWON, Jun Woo LEE, Euihyun KONG, Jonggi KIM, Sang Cheon PARK, Onyou PARK, Heeje WOO, Sungseo CHO, Hyunjoo HAN
  • Publication number: 20170306433
    Abstract: Disclosed are a steel pipe having a three-layer structure and a manufacturing method thereof. The steel pipe includes a three-layer structure of bainite and martensite, which are formed by high-frequency induction heating thereby improving toughness to enhance crash performance of a vehicle. The steel pipe includes a bainite structure layer, a bainite and martensite dual-phase structure layer, and a martensite structure layer.
    Type: Application
    Filed: August 29, 2016
    Publication date: October 26, 2017
    Inventor: Sang-Cheon Park
  • Publication number: 20170115460
    Abstract: Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure.
    Type: Application
    Filed: October 4, 2016
    Publication date: April 27, 2017
    Inventors: Byung In KIM, Sang Cheon PARK
  • Publication number: 20170110388
    Abstract: A semiconductor device includes a semiconductor chip having an active surface and a non-active surface opposite to the active surface, an upper insulating layer provided on the non-active surface of semiconductor chip, and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively. The connection pad has a first surface exposed outside the upper insulating layer and a second surface opposite to the first surface and facing the semiconductor chip. The first surface of the connection pad is coplanar with an upper surface of the upper insulating layer.
    Type: Application
    Filed: October 11, 2016
    Publication date: April 20, 2017
    Inventors: Sang Cheon PARK, Won Il LEE, Chajea JO, Taeje CHO
  • Patent number: 9618716
    Abstract: A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Cheon Park, Cha-Jea Jo, Tae-Je Cho
  • Patent number: 9487695
    Abstract: The present invention relates to an optical film and an optical display apparatus including the same. The optical film may include a base film and an optical functional layer formed on the base film, wherein at least one of the base film. The optical functional layer may include a luminescent material, and the luminescent material may include at least one of a fluorescent material and a phosphorescent material.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: November 8, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Jin Woo Kim, Moon Soo Choi, Gi Wook Kang, Sang Cheon Park, Chul Jin Park, Hyoun Young Kim, Jong Hyuk Eun, Gyu Cheol Lee, Mi Young Chae
  • Publication number: 20160263814
    Abstract: Provided is a method for forming a pattern of polyimide that is simpler and is more excellent in the pattern shape and in the dimensional accuracy in comparison with the conventional techniques of patterning polyimide, such as photolithography and laser processing. In a method for forming a micropattern of polyimide, which includes using as polyimide a solvent-soluble polyimide resin composition that is photosensitive and is moldable at a temperature of less than or equal to a glass-transition temperature; patterning the composition using thermal imprinting; and thermally curing the composition, ultraviolet irradiation is performed after the composition is released from a mold after a molding step.
    Type: Application
    Filed: August 29, 2014
    Publication date: September 15, 2016
    Applicant: National Institute of Advanced Industrial Science and Technology
    Inventors: Sung Won YOUN, Sang Cheon PARK, Hiroshi HIROSHIMA, Hideki Takagi, Kenta Suzuki
  • Publication number: 20160266341
    Abstract: A photonic integrated circuit is provided. The photonic integrated circuit includes a substrate having a through hole interconnecting a first surface and a second surface; a transmission wire passing through the through hole and including an optical transmission structure and an electrical transmission structure; and an optical-to-electrical converter connected to the optical transmission structure of the transmission wire on the first surface.
    Type: Application
    Filed: January 5, 2016
    Publication date: September 15, 2016
    Inventors: Sang-Cheon PARK, Cha-Jea JO, Tae-je CHO
  • Publication number: 20160187682
    Abstract: A liquid crystal display module includes first and second polarizing plates, and a liquid crystal panel between the polarizing plates. The second polarizing plate comprises an optical film on a polarizer. The optical film comprises a high refractive index pattern layer having at least one engraved pattern, and a low refractive index pattern layer having a filling pattern that fills at least a portion of the engraved pattern. The high refractive index pattern layer has a higher refractive index than the low refractive index pattern layer. The optical film is disposed such that light emitted from the liquid crystal panel will enter the low refractive index pattern layer and then be emitted through the high refractive index pattern layer. A liquid crystal display includes the liquid crystal display module.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 30, 2016
    Inventors: Young Oh, Seong Hoon Lee, Jeong Ho Lee, Young Hyun Ju, Sang Cheon Park
  • Publication number: 20160040814
    Abstract: The present invention relates to a tube-fitting structure for a pure-water line of a water purifier or refrigerator. The present invention provides a tube connecting structure in which a tube fitted into a body having a fitting part formed therein is fixed by a cap, wherein a guide groove formed to have a receiving recess curved downward is formed on an outer circumferential surface of a tube link part of the body, and wherein a guide protrusion is formed on an inner circumferential surface of the tube corresponding to the outer circumferential surface of the body to allow the guide protrusion to be coupled along the guide groove, so that the tube is easily assembled with the body while the cap is rotated due to an inclined surface of the guide groove. Thus, in spite of enhancing the air tightness of the fitting structure, the assembly is improved.
    Type: Application
    Filed: October 19, 2015
    Publication date: February 11, 2016
    Inventors: Whi-Dong JUNG, Min-Won KIM, Jae-Ik LEE, Pil-Kang HWANG, Sang-Cheon PARK, Sung-Muk KANG
  • Patent number: 9056935
    Abstract: A photocurable resin composition includes an ester (meth)acrylate, an antistatic agent, a silicone additive, an initiator, and at least one UV-curable unsaturated compound. The at least one UV-curable unsaturated compound may include a monofunctional or multifunctional UV-curable monomer, and a (meth)acrylate containing about 10 mol % or more of an ethylene oxide group.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: June 16, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Hyoun Young Kim, Sang Cheon Park, Keun Young Kim