Patents by Inventor Sang Chul Sul

Sang Chul Sul has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8029681
    Abstract: Provided are a master recording medium and a method of manufacturing the master recording medium. The master recording medium includes: a plate; and a magnetic layer which is formed on the plate for magnetically transferring of a servo pattern that is to be formed on a magnetic recording medium. The method of manufacturing a master recording medium includes: engraving a polymer layer by nano imprinting to form an engraved pattern corresponding to a servo pattern to be formed on a magnetic recording medium; forming a magnetic layer which fills in the engraved pattern of the polymer layer; forming a back plate layer on the magnetic layer; and performing processing to expose the servo pattern on a surface of the magnetic layer that is opposite a surface of the magnetic layer on which the back plate layer is formed.
    Type: Grant
    Filed: May 22, 2009
    Date of Patent: October 4, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-won Na, Sang-chul Sul, Du-hyun Lee, Myung-bok Lee, Hae-sung Kim, Jin-seung Sohn
  • Publication number: 20110128423
    Abstract: An image sensor includes a plurality of color sensors, a plurality of depth sensors, a near-infrared cut filter, a color filter, a pass filter and a rejection filter. The color sensors and depth sensors are formed on a substrate. The near-infrared cut filter and the color filter are formed on the color sensors. The pass filter is formed on the depth sensors, and is adapted to transmit light having a wavelength longer than an upper limit of a visible light wavelength. The pass filter has a multi-layer structure wherein a semiconductor material and a semiconductor oxide material are alternately stacked. The rejection filter is formed over the near-infrared cut filter, the color filter and the pass filter, and is adapted to transmit light having a wavelength shorter than an upper limit of a near-infrared light wavelength.
    Type: Application
    Filed: November 11, 2010
    Publication date: June 2, 2011
    Inventors: Myung-Bok LEE, Sang-Chul Sul, Young-Gu Jin
  • Publication number: 20110102547
    Abstract: Image sensors include three-dimensional (3D) color image sensors having an array of sensor pixels therein. A 3-D color image sensor may include a 3-D image sensor pixel having a plurality of color sensors and a depth sensor therein. The plurality of color sensors may include red, green and blue sensors extending adjacent the depth sensor. A rejection filter is also provided. This rejection filter, which extends opposite a light receiving surface of the 3-D image sensor pixel, is configured to be selectively transparent to visible and near-infrared light relative to far-infrared light. The depth sensor may also include an infrared filter that is selectively transparent to near-infrared light having wavelengths greater than about 700 nm relative to visible light.
    Type: Application
    Filed: October 15, 2010
    Publication date: May 5, 2011
    Inventors: Sang-Chul Sul, Won-Cheol Jung, Yoon-Dong Park, Myung-Bok Lee, Young-Gu Jin
  • Publication number: 20110013055
    Abstract: Example embodiments are directed to a semiconductor device including a color pixel array on a substrate; a distance pixel array on the substrate; a light-inducing member on the color pixel array and the distance pixel array; an infrared light cut filter on the light-inducing member and configured to block infrared light; a near infrared light filter on the light-inducing member and configured to allow near infrared light to pass; and an RGB filter on the light-inducing member and configured to allow visible light to pass.
    Type: Application
    Filed: July 2, 2010
    Publication date: January 20, 2011
    Inventors: Sang-Chul Sul, Myung-Bok Lee, Hoon-Sang Oh, Young-Gu Jin
  • Publication number: 20110001205
    Abstract: Example embodiments relate to a three-dimensional image sensor including a color pixel array on a substrate, a distance pixel array on the substrate, an RGB filter on the color pixel array and configured to allow visible light having a first wavelength to pass, a near infrared light filter on the distance pixel array and configured to allow near infrared light having a second wavelength to pass, and a stack type single band filter on the RGB filter and the near infrared light filter and configured to allow light having a third wavelength between the first wavelength and the second wavelength to pass.
    Type: Application
    Filed: June 23, 2010
    Publication date: January 6, 2011
    Inventors: Sang-Chul Sul, Yoon-Dong Park, Myung-Bok Lee, Young-Gu Jin
  • Publication number: 20100273027
    Abstract: A magnetic printing stamp and a magnetic printing method using the same. The magnetic printing stamp may includes a plurality of servo regions having a magnetic body pattern and a plurality of data regions having no magnetic body pattern that are alternately formed, wherein a thickness of a portion of a substrate corresponding to each of the servo regions is less than a thickness of a portion of the substrate corresponding to each of the data regions. When a servo pattern is to be magnetically printed, the magnetic printing stamp and a magnetic recording medium uniformly and completely come in contact with each other. Thus, the magnetic printing stamp and the magnetic recording medium are prevented from being contaminated or damaged. In addition, excellent magnetic printing properties corresponding to an uneven pattern may be achieved.
    Type: Application
    Filed: April 15, 2010
    Publication date: October 28, 2010
    Inventors: Myung-bok Lee, Kyoung-won Na, Sang-chul Sul
  • Patent number: 7795692
    Abstract: A resonator including a substrate, and a resonating unit having an active region that causes resonances and a non-active region that does not cause resonances, and having a first electrode, a piezoelectric film, and a second electrode layered in turn on the substrate. At least one of the first and the second electrodes is formed, so that at least a portion of a non-active region portion thereof has a thickness different from that of an active region portion thereof.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: September 14, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-ho Lee, Hae-seok Park, Sang-hun Lee, Duck-hwan Kim, Sang-chul Sul
  • Publication number: 20100002565
    Abstract: The servo master includes a membrane having a first surface and a second surface; a plurality of stamp areas which are disposed on the first surface, each of the plurality of stamp areas including a magnetic layer patterned with servo patterns to be magnetically transferred to a magnetic recording medium; and a pressing members which are disposed on the second surface, each of the plurality of pressing members being operable to apply pressure to a corresponding stamp area of the plurality of stamp areas.
    Type: Application
    Filed: July 2, 2009
    Publication date: January 7, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung-won NA, Jin-seung SOHN, Sang-chul Sul
  • Publication number: 20090297889
    Abstract: Provided are a master recording medium and a method of manufacturing the master recording medium. The master recording medium includes: a plate; and a magnetic layer which is formed on the plate for magnetically transferring of a servo pattern that is to be formed on a magnetic recording medium. The method of manufacturing a master recording medium includes: engraving a polymer layer by nano imprinting to form an engraved pattern corresponding to a servo pattern to be formed on a magnetic recording medium; forming a magnetic layer which fills in the engraved pattern of the polymer layer; forming a back plate layer on the magnetic layer; and performing processing to expose the servo pattern on a surface of the magnetic layer that is opposite a surface of the magnetic layer on which the back plate layer is formed.
    Type: Application
    Filed: May 22, 2009
    Publication date: December 3, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung-won NA, Sang-chul SUL, Du-hyun LEE, Myung-bok LEE, Hae-sung KIM, Jin-seung SOHN
  • Publication number: 20090296280
    Abstract: Provided is a master recording medium suitable for use in magnetic transfer of a servo pattern onto a magnetic recording medium. The master recording medium includes a substrate including a plurality of servo regions and a plurality of data regions, and a magnetic layer formed on each of the servo regions and patterned in the shape of a servo pattern to be patterned on a magnetic recording medium, wherein the servo regions protrude relative to the data regions.
    Type: Application
    Filed: May 27, 2009
    Publication date: December 3, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyoung-won Na, Myung-bok LEE, Sang-chul SUL, Jin-seung SOHN
  • Publication number: 20090147397
    Abstract: Provided are a patterned magnetic recording medium and a method of recording track information onto the patterned magnetic recording medium. The patterned magnetic recording medium includes: a data sector comprising a plurality of magnetic recording regions which are spaced apart from one another, wherein the magnetic recording regions constitute a plurality of tracks which are each shaped like a ring; and a servo sector comprising servo patterned regions and correction code regions, which are each provided on each of the plurality of tracks, wherein information regarding a track that is to be actually used in a hard disk drive (HDD) is recorded on a correction code region of at least one track of the plurality of tracks.
    Type: Application
    Filed: April 9, 2008
    Publication date: June 11, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hae-sung Kim, Jun Jeong, Hyun-seok Yang, No-cheol Park, Jin-seung Sohn, Sang-chul Sul
  • Publication number: 20090147402
    Abstract: Provided are a patterned magnetic recording medium and a method of self servo writing in which servo information is written on the patterned magnetic recording medium. The patterned magnetic recording medium includes: a data sector including a plurality of magnetic recording regions spaced apart from one another, wherein the magnetic recording regions constitute a plurality of tracks which are each shaped like a ring; and a servo sector on which servo information regarding the tracks is capable of being written along the tracks, wherein only to a part of the tracks of the servo sector, servo information regarding the part of the tracks is written in the form of a physical servo pattern which is formed by physically patterning a magnetic recording layer.
    Type: Application
    Filed: April 11, 2008
    Publication date: June 11, 2009
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-chul SUL, Jun JEONG, Hyun-seok YANG, No-cheol PARK, Jin-seung SOHN, Hae-sung KIM
  • Patent number: 7518410
    Abstract: A duplexer is provided. The duplexer includes a first band pass filter (BPF) coupled to a first signal port and a second signal port; and a second BPF coupled to the first signal port and a third signal port, each of the first BPF and the second BPF including a first resonance circuit which comprises a plurality of first resonators coupled in series; a second resonance circuit which comprises a plurality of second resonators coupled in series; and a third resonance circuit which comprises a plurality of third resonators coupled in parallel and formed in divided lines coupling the first and second resonance circuits.
    Type: Grant
    Filed: January 3, 2007
    Date of Patent: April 14, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yun-kwon Park, Sang-chul Sul, In-sang Song, Chul-soo Kim, Seok-chul Yun, Kuang-woo Nam
  • Patent number: 7439825
    Abstract: An integrated filter including a film bulk acoustic resonator (FBAR) and a surface acoustic wave (SAW) resonator and a method of fabricating the integrated filter. The integrated filter includes: a substrate; a first electrode positioned in a predetermined first area on an upper surface of the substrate; a first piezoelectric layer positioned on the first electrode; a second electrode positioned on the first piezoelectric layer; a second piezoelectric layer positioned in a predetermined second area on the upper surface of the substrate; and at least one inter-digital transducer (IDT) electrode positioned on the second piezoelectric layer. The IDT electrode includes: a first IDT electrode formed in a comb structure on the second piezoelectric layer; and a second IDT electrode formed in a comb structure on the second piezoelectric layer so as to mesh with the first IDT electrode. The first and second piezoelectric layers are formed of an identical material.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: October 21, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kuang-woo Nam, Kook-hyun Sunwoo, In-sang Song, Sang-wook Kwon, Duck-hwan Kim, Chul-soo Kim, Sang-chul Sul, Yun-kwon Park, Hae-seok Park, Jea-shik Shin, Dong-ha Shim, Young-tack Hong, Jong-seok Kim, Seok-mo Chang, Seok-chul Yun
  • Patent number: 7432781
    Abstract: A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a plurality of first ground planes formed between the plurality of elements. A cap wafer is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts, and cavities. Second sealing parts are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes cover the plurality of ground posts. Via holes vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: October 7, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-chul Sul, Duck-hwan Kim, Chul-soo Kim, In-sang Song, Moon-chul Lee, Kyu-dong Jung, Jea-shik Shin
  • Patent number: 7423501
    Abstract: A film bulk acoustic resonator includes a substrate; a lower electrode formed on top of the substrate; a piezoelectric membrane formed on top of the lower electrode and having a crystallographic axis so inclined as to generate a total reflection when an acoustic wave advances toward the lower electrode; and an upper electrode formed on top of the piezoelectric membrane.
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: September 9, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Duck-hwan Kim, Chul-soo Kim, Yun-kwon Park, Sang-chul Sul, Byeoung-ju Ha, In-sang Song
  • Publication number: 20080042780
    Abstract: A resonator including a substrate, and a resonating unit having an active region that causes resonances and a non-active region that does not cause resonances, and having a first electrode, a piezoelectric film, and a second electrode layered in turn on the substrate. At least one of the first and the second electrodes is formed, so that at least a portion of a non-active region portion thereof has a thickness different from that of an active region portion thereof.
    Type: Application
    Filed: January 25, 2007
    Publication date: February 21, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD
    Inventors: Joo-ho Lee, Hae-seok Park, Sang-hun Lee, Duck-hwan Kim, Sang-chul Sul
  • Publication number: 20070182509
    Abstract: A duplexer is provided. The duplexer includes a first band pass filter (BPF) coupled to a first signal port and a second signal port; and a second BPF coupled to the first signal port and a third signal port, each of the first BPF and the second BPF including a first resonance circuit which comprises a plurality of first resonators coupled in series; a second resonance circuit which comprises a plurality of second resonators coupled in series; and a third resonance circuit which comprises a plurality of third resonators coupled in parallel and formed in divided lines coupling the first and second resonance circuits.
    Type: Application
    Filed: January 3, 2007
    Publication date: August 9, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yun-kwon Park, Sang-chul Sul, In-sang Song, Chul-soo Kim, Seok-chul Yun, Kuang-woo Nam
  • Patent number: 7196596
    Abstract: An FBAR filter includes a wafer, a filter circuit unit and a balun circuit unit. The filter circuit unit includes a plurality of FBAR resonators formed on a predetermined region on a top of the wafer. The balun circuit unit includes a plurality of metal layers electrically connected to each other to implement a balun circuit and a plurality of dielectric layers each placed between the plurality of metal layers. The balun circuit unit is electrically connected to the filter circuit unit on a predetermined region of the wafer.
    Type: Grant
    Filed: February 17, 2005
    Date of Patent: March 27, 2007
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sang Chul Sul
  • Publication number: 20070024391
    Abstract: A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a plurality of first ground planes formed between the plurality of elements. A cap wafer is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts, and cavities. Second sealing parts are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes cover the plurality of ground posts. Via holes vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.
    Type: Application
    Filed: March 30, 2006
    Publication date: February 1, 2007
    Inventors: Sang-chul Sul, Duck-hwan Kim, Chul-soo Kim, In-sang Song, Moon-chul Lee, Kyu-dong Jung, Jea-shik Shin