Abstract: The present invention is directed to a method of making at least a portion of a garment that includes at least one three-dimensional contour. The disclosed method includes providing a fiber and solvent mixture that includes fibers and a solvent capable to causing a plurality of covalent bonds to be created between the fibers. In many embodiments, the plurality of covalent bonds form when a catalyst, such as heat, is provided to the fiber and solvent mixture. The process can be performed using, for example, either a 3D printer or mold form. The fibers used can be natural, synthetic, or a blend of natural and/or synthetic fibers. The solvent preferably includes ionic salts in water.

Abstract: A display device includes an electrode, a protection layer disposed on the electrode, and an encapsulation organic layer disposed on the protection layer. In a first area, an edge of the encapsulation organic layer is spaced a first distance from an edge of the electrode, and the edge of the encapsulation organic layer is spaced a second distance from an edge of the protection layer. In the second area, the edge of the encapsulation organic layer is disposed between the edge of the electrode and the edge of the protection layer. In the second area, the edge of the encapsulation organic layer is spaced a third distance, greater than the first distance, from the edge of the electrode, and the edge of the encapsulation organic layer is spaced a fourth distance, greater than the second distance, from the edge of the protection layer.

Abstract: A cosmetic container may comprise a tubular sleeve that defines a cavity. The tubular sleeve may include a first end with a first opening and a second end with a second opening. The first opening may be defined by at least one upper sidewall which may include outer threads. The cosmetic container may include a cap assembly which may be configured to engage with the second opening of the second end, thereby sealing the second opening of the second end.

Abstract: Methods of manufacturing and fixtures for manufacturing containers, particularly for holding cosmetic products, using thin-walled tubes. One end of a container may be formed using an integral process, such as insert molding, while the other end of the container is formed using assembly steps, such as welding, to form a completed cosmetics container from a thin-walled tube.

Abstract: An image sensor comprises a substrate that includes a front surface and a rear surface opposite to each other, a plurality of unit pixels disposed in the substrate, where each unit pixel includes a photoelectric conversion layer, a floating diffusion region, and a transfer transistor that electrically connects the photoelectric conversion layer to the floating diffusion region, a pixel isolation pattern that penetrates the substrate in a first direction and defines respective unit pixels, and a microlens disposed on a rear surface of the substrate. The transfer transistor includes a gate electrode that includes a first portion that extends in a second direction along the pixel isolation pattern and a second portion that extends in a third direction along the pixel isolation pattern, and a height from the rear surface of the substrate to a top surface of the gate electrode is less than a thickness of the substrate.

Abstract: Packaging may include a base box and a lid having a tamper-evident seal. The tamper-evident seal may include a paper substrate having a first adhesive portion configured to attach to a side panel of the base box, a second adhesive portion configured to attach to a second side panel of the lid. The first and second adhesive portions may be disposed on opposing sides of the paper substrate, and a tab configured to be accessible on an exterior of a package when the tamper-evident seal is applied may be a part of the paper substrate. When the tab is pulled with sufficient force, the paper substrate tears such that the first adhesive portion and the second adhesive portion remain fixed to the first and second side panels, respectively, while the remainder of the paper substrate tears free so that the packaging may be opened.

Abstract: An image sensor may include a substrate having a first surface and a second surface on opposite sides, a first transistor having a first gate disposed on the first surface, a photoelectric conversion layer which generates photocharges from light incident in a first direction, a second transistor having a transistor structure disposed between the first surface and the photoelectric conversion layer and spaced from the photoelectric conversion layer, and includes a semiconductor layer composed of a metal oxide semiconductor material. The semiconductor layer may have a third surface facing the first direction and a fourth surface opposite the third surface, with a second gate disposed on the semiconductor layer. The semiconductor layer may be connected to the first gate. A light blocking layer may be disposed between the third surface and the photoelectric conversion layer, and spaced from the photoelectric conversion layer.

Abstract: An automatic fog identification method using a front camera image and a emergency fog red LED high beam system using the same are proposed. The emergency fog red LED high beam system is configured such that a red LED module is applied to a high beam light source, thus providing a clear and wide view for a driver without diffused reflection even in a foggy situation.

Abstract: Methods of manufacturing and fixtures for manufacturing containers, particularly for holding cosmetic products, using thin-walled tubes. One end of a container may be formed using an integral process, such as insert molding, while the other end of the container is formed using assembly steps, such as welding, to form a completed cosmetics container from a thin-walled tube.

Abstract: A cosmetic container may include a bottle having a first open end and a second open end, defining a cavity therebetween. A sealing film may be adapted for placement at the second open end of the bottle, and a cap may be configured to engage with the second open end of the bottle, such that the cap fits over the sealing film thereby covering the sealing film and closing the second open end. The first open end may be adapted for dispensing a product held within the cavity of the bottle.

Abstract: A combination cosmetic container and product may include a base which may have a first open end and a second closed end, defining a cavity therebetween. The combination cosmetic container may include a solid stick cosmetic product which may be adapted for placement within the cavity of the base. A cap may be removably coupled to the base, and the cap may be configured to engage with the first open end of the base to cover the solid stick cosmetic product and close the cosmetic container. Compression of the base in an inward direction may cause the solid stick cosmetic product to advance through the first open end of the base when the cap is removed from the cosmetic container.

Abstract: An image sensor may include a substrate having a first surface and a second surface on opposite sides, a first transistor having a first gate disposed on the first surface, a photoelectric conversion layer which generates photocharges from light incident in a first direction, a second transistor having a transistor structure disposed between the first surface and the photoelectric conversion layer and spaced from the photoelectric conversion layer, and includes a semiconductor layer composed of a metal oxide semiconductor material. The semiconductor layer may have a third surface facing the first direction and a fourth surface opposite the third surface, with a second gate disposed on the semiconductor layer. The semiconductor layer may be connected to the first gate.

Abstract: An image sensor includes a first organic photoelectric conversion layer on a base layer, a floating diffusion region in the base layer, a first storage node including a first electrode layer, which is configured to receive a bias signal, a first portion of a first semiconductor layer which includes a semiconductor material, and a first portion of a first dielectric layer. The first dielectric layer extends between the first electrode layer and the first semiconductor layer. The first storage node is electrically connected to the first organic photoelectric conversion layer. The image sensor includes a first transfer transistor including the first dielectric layer, the first semiconductor layer, and a first transfer gate electrode which is configured to receive first transfer control signal. The first transfer transistor has a first end electrically connected to the first storage node and a second end electrically connected to the floating diffusion region.

Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.

Abstract: A cosmetic container may comprise a tubular sleeve that defines a cavity. The tubular sleeve may include a first end with a first opening and a second end with a second opening. The first opening may be defined by at least one upper sidewall which may include outer threads. The cosmetic container may include a cap assembly which may be configured to engage with the second opening of the second end, thereby sealing the second opening of the second end.

Abstract: An image sensor includes a first organic photoelectric conversion layer on a base layer, a floating diffusion region in the base layer, a first storage node including a first electrode layer, which is configured to receive a bias signal, a first portion of a first semiconductor layer which includes a semiconductor material, and a first portion of a first dielectric layer. The first dielectric layer extends between the first electrode layer and the first semiconductor layer. The first storage node is electrically connected to the first organic photoelectric conversion layer. The image sensor includes a first transfer transistor including the first dielectric layer, the first semiconductor layer, and a first transfer gate electrode which is configured to receive first transfer control signal. The first transfer transistor has a first end electrically connected to the first storage node and a second end electrically connected to the floating diffusion region.

Abstract: A cosmetic container and applicator system for magnetic cosmetic products may include a housing defining a reservoir for containing a magnetic cosmetic product, and an applicator configured to extend into the reservoir. The applicator includes a magnet. A wiper may extend into the reservoir and have a bottom end with an opening through which the applicator extends. The wiper may be configured to remove excess product from the applicator as the applicator is withdrawn from the reservoir.

Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.