Abstract: A ball grid array package includes a semiconductor chip 4, a circuit board 21 including a plurality of pattern layers of conductive wiring and dielectric layers interposed between the pattern layers which include the first pattern layer 22 and the second pattern layer 23. Electrically conductive wires are provided for interconnecting the semiconductor chip and the conductive wiring, mold resin 4 encapsulates the semiconductor chip and the wiring, and a plurality of solder balls 5 are adhered to a bottom surface of the circuit board 21 and electrically interconnected to the wires via the pattern layers. The surface mounting pad 22 is formed on the first pattern layer and a second conductive pad is formed on the second pattern layer.

Abstract: A semiconductor memory module is formed of semiconductor packages respectively having at least one defect data line combined to be mounted to a module substrate which has two rows of auxiliary pads for excluding the defect data line of the mounted semiconductor packages from overall data lines of the module to thus attain more than a required memory capacity. By connecting the auxiliary pads with coupling units of resistors or jumper cables to isolate the defect data lines, the semiconductor memory module achieves the required memory capacity and utilizes defective semiconductor packages to reduce manufacturing costs, to attain excellent compatibility resulting from employing all kinds of semiconductor packages, and to simplify the data line connection process. Further, reworking semiconductor package is easy which improves yield, and humid air is prevented from permeating into the interior of the molding resin thereby preventing failures such as disconnection of wires and improving reliability.