Patents by Inventor Sang Eun LIM

Sang Eun LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package and light emitting module comprising the same
    Patent number: 9172020
    Abstract: The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: October 27, 2015
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Byoung Sung Kim, Sang Eun Lim, Jae Jin Lee, Yeoun Chul Son
  • LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME
    Publication number: 20140299910
    Abstract: The present invention provides a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is disposed, and a package body having a cavity and supporting the lead frame. The chip area is exposed through the cavity. The lead frame includes a first terminal group disposed at a first side of the chip area and a second terminal group disposed at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area. The second terminal of the first terminal group is exposed through the cavity, and the second terminal of the second terminal group is buried in the package body.
    Type: Application
    Filed: June 20, 2014
    Publication date: October 9, 2014
    Inventors: Byoung Sung Kim, Sang Eun Lim, Jae Jin Lee, Yeoun Chul Son
  • Light emitting diode package and light emitting module comprising the same
    Patent number: 8823041
    Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: September 2, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Byoung Sung Kim, Sang Eun Lim, Jae Jin Lee, Yeoun Chul Son
  • Light emitting diode package and light emitting module comprising the same
    Patent number: 8692282
    Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.
    Type: Grant
    Filed: December 30, 2011
    Date of Patent: April 8, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Byoung Sung Kim, Sang Eun Lim, Jae Jin Lee, Yeoun Chul Son
  • LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME
    Publication number: 20130107548
    Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal connected to the chip area and a second terminal separated from the chip area, and the width of the first terminal is different than the width of the second terminal outside the package body.
    Type: Application
    Filed: August 6, 2012
    Publication date: May 2, 2013
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Byoung Sung KIM, Sang Eun LIM, Jae Jin LEE, Yeoun Chul SON
  • LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME
    Publication number: 20130105851
    Abstract: Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.
    Type: Application
    Filed: December 30, 2011
    Publication date: May 2, 2013
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Byoung Sung KIM, Sang Eun LIM, Jae Jin LEE, Yeoun Chul SON