Patents by Inventor Sangeun NOH

Sangeun NOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit heat exchanger and heat exchange device including the same
    Patent number: 11333448
    Abstract: A printed circuit heat exchanger is provided. The printed circuit heat exchanger may include: a first bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels; and a second bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels, wherein the first bonding plate and the second bonding plate are alternately stacked.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: May 17, 2022
    Inventors: Kihoon Yang, Sangeun Noh, Jeongkil Kim, Jungshin Park
  • PRINTED CIRCUIT HEAT EXCHANGER AND HEAT EXCHANGE DEVICE INCLUDING THE SAME
    Publication number: 20200088475
    Abstract: A printed circuit heat exchanger is provided. The printed circuit heat exchanger may include: a first bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels; and a second bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels, wherein the first bonding plate and the second bonding plate are alternately stacked.
    Type: Application
    Filed: August 2, 2019
    Publication date: March 19, 2020
    Inventors: Kihoon YANG, Sangeun NOH, Jeongkil KIM, Jungshin PARK