Abstract: A grass protection mat and a mat assembly having the same are provided. The grass protection mat of the invention includes a body made of polygonal portions, pillars protruded upward from the body, buffer wings protruded upward from the body between the pillars for distributing weights, an outer frame at the periphery of the body, lug members protruded from lower parts of the body and the outer frame. The mat also includes slide-type hooking means laterally protruded for connection of the mats, an opening formed at the inner surface of the outer frame. The mat assembly includes various forms of mat fastening members for connecting the grass protection mats. The invention facilitates connection of the mats and enhances assemblability of the mat assembly, effectively preventing sinking of the mats into the ground, thereby maintaining protection of grass.

Abstract: A wireless audio output device, a wireless audio output system including the same and a control method thereof are disclosed. When a user approaches the output device, while listening to music on a portable device, the output device automatically connects the wireless audio output system to the portable device, to reproduce the music of the portable device. The control method includes detecting the user, detecting the portable device if the user is sensed, and outputting an audio file being reproduced by the portable device using the wireless audio output system, if the portable device is detected.

Abstract: A grass protection mat and a mat assembly having the same are provided. The grass protection mat of the invention includes a body made of polygonal portions, pillars protruded upward from the body, buffer wings protruded upward from the body between the pillars for distributing weights, an outer frame at the periphery of the body, lug members protruded from lower parts of the body and the outer frame. The mat also includes slide-type hooking means laterally protruded for connection of the mats, an opening formed at the inner surface of the outer frame. The mat assembly includes various forms of mat fastening members for connecting the grass protection mats. The invention facilitates connection of the mats and enhances assemblability of the mat assembly, effectively preventing sinking of the mats into the ground, thereby maintaining protection of grass.

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount head is aligned; a chip transfer unit for transferring the semiconductor chip from the semiconductor chip pickup stage to the alignment stage; a guide rail for guiding a mount tape frame; a status inspecting unit disposed at a selected position over the guide rail, for inspecting a status and a position of the land pattern on the mount tape frame; and a bonding unit for bonding the land pattern to the semiconductor chip which is mounted on the mount head. The equipment only bonds semiconductor chips (good or defective) to lands patterns having the same status (good or defective).

Abstract: A frequency using method for minimizing a time for an initial synchronization between a mobile station and a base station in a mobile telecommunication system. The frequency using method includes the steps of inputting current time data; reading out an initial synchronization frequency from an internal memory; determining an initial synchronization hopping frequency and an initial synchronization hopping cycle according to a hopping pattern polynomial and the current time data; and sequentially searching for frequencies within a communication channel on a one-by-one basis according to the initial synchronization hopping frequency and the initial synchronization hopping cycle to produce a synchronized frequency to establish synchronization between the mobile station and the base station.