Patents by Inventor Sang Goo Kang

Sang Goo Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating semiconductor package and semiconductor package using the same
    Patent number: 9613829
    Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: April 4, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang