Patents by Inventor Sang-Guk Han
Sang-Guk Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9627360Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: September 12, 2016Date of Patent: April 18, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20170018535Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: September 12, 2016Publication date: January 19, 2017Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9449716Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: May 22, 2015Date of Patent: September 20, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9171644Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: May 7, 2015Date of Patent: October 27, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20150257255Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: May 22, 2015Publication date: September 10, 2015Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20150243371Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 9069036Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: December 12, 2013Date of Patent: June 30, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Patent number: 8917107Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: July 31, 2012Date of Patent: December 23, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon, Beom-jun Jin
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Publication number: 20140097865Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: December 12, 2013Publication date: April 10, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20120292091Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: July 31, 2012Publication date: November 22, 2012Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 8248093Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: July 16, 2010Date of Patent: August 21, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 8203355Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: October 22, 2010Date of Patent: June 19, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20110037491Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: October 22, 2010Publication date: February 17, 2011Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 7872483Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: GrantFiled: September 4, 2008Date of Patent: January 18, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Seok-Joon Moon
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Publication number: 20100289157Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: July 16, 2010Publication date: November 18, 2010Inventors: Sang-Guk Han, Seok-Joon Moon
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Patent number: 7606046Abstract: A semiconductor device including a PCB including conductive patterns formed on at least one surface of the PCB, external connection terminals including at least one ground terminal and coupled to the conductive patterns, at least one semiconductor chip mounted on a surface of the PCB, and an ESD protection pattern being coupled to at least one of the least one ground terminal, the at least one ground terminal not being coupled to the conductive patterns. A semiconductor memory device, including a PCB, a memory chip mounted on a first surface of the PCB, external connection terminals formed on a second surface of the PCB, and a first ESD protection pattern being coupled to at least one ground terminal. A method of mitigating ESD in a semiconductor device, including mounting a chip on a PCB, forming conductive patterns on the PCB, and forming at least one ESD protection pattern on the PCB, the ESD protection pattern being connected to a ground terminal and not being coupled to the conductive patterns.Type: GrantFiled: October 4, 2004Date of Patent: October 20, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Guk Han, Chan-Min Han
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Publication number: 20090153163Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.Type: ApplicationFiled: September 4, 2008Publication date: June 18, 2009Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Guk HAN, Seok-Joon MOON
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Publication number: 20080046640Abstract: Provided is a memory system receiving an external supply voltage from a host. The memory system includes a plurality of flash memories, a memory controller generating a respective chip selection signals respectively selecting one or more of the plurality of the flash memories in response to a request from the host, and a switch controlling supply of the external supply voltage to at least one of the plurality of flash memories in response to at least one of the chip selection signals.Type: ApplicationFiled: May 9, 2007Publication date: February 21, 2008Inventor: Sang-Guk Han
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Publication number: 20050184313Abstract: A semiconductor device including a PCB including conductive patterns formed on at least one surface of the PCB, external connection terminals including at least one ground terminal and coupled to the conductive patterns, at least one semiconductor chip mounted on a surface of the PCB, and an ESD protection pattern being coupled to at least one of the least one ground terminal, the at least one ground terminal not being coupled to the conductive patterns. A semiconductor memory device, including a PCB, a memory chip mounted on a first surface of the PCB, external connection terminals formed on a second surface of the PCB, and a first ESD protection pattern being coupled to at least one ground terminal. A method of mitigating ESD in a semiconductor device, including mounting a chip on a PCB, forming conductive patterns on the PCB, and forming at least one ESD protection pattern on the PCB, the ESD protection pattern being connected to a ground terminal and not being coupled to the conductive patterns.Type: ApplicationFiled: October 4, 2004Publication date: August 25, 2005Inventors: Sang-Guk Han, Chan-Min Han