Abstract: A semiconductor memory cell is provided that includes a trench capacitor and an access transistor. The access transistor comprises a source region, a drain region, a gate structure overlying the trench capacitor, and an active body region that couples the drain region to the source region. The active body region directly contacts the trench capacitor.

Abstract: A mechanism is provided for reducing power consumed by a multi-core processor. Responsive to a number of properly functioning processor cores being more than a required number of processor cores in a multi-core processor, the power consumption measurement module determines a number of the properly functioning processor cores to disable. The power consumption measurement module initiates an equal amount of workload to be processed by each of the properly functioning processor cores. The power consumption measurement module determines power consumed by each of the properly functioning processor cores. The power consumption measurement module deactivates one or more of the properly functioning processor cores that have maximum power in order that the number of properly functioning processor cores deactivated is equal to the number of properly functioning processor cores to disable.

Abstract: A mechanism is provided for reducing power consumed by a multi-core processor. Responsive to a number of properly functioning processor cores being more than a required number of processor cores in a multi-core processor, the power consumption measurement module determines a number of the properly functioning processor cores to disable. The power consumption measurement module initiates an equal amount of workload to be processed by each of the properly functioning processor cores. The power consumption measurement module determines power consumed by each of the properly functioning processor cores. The power consumption measurement module deactivates one or more of the properly functioning processor cores that have maximum power in order that the number of properly functioning processor cores deactivated is equal to the number of properly functioning processor cores to disable.

Abstract: A semiconductor memory cell is provided that includes a trench capacitor and an access transistor. The access transistor comprises a source region, a drain region, a gate structure overlying the trench capacitor, and an active body region that couples the drain region to the source region. The active body region directly contacts the trench capacitor.

Abstract: A method for fabricating a memory cell is provided. A trench is formed in a semiconductor structure that comprises a semiconductor layer, and a trench capacitor is formed in the trench. Conductivity determining impurities are implanted into the semiconductor structure to create a well region in the semiconductor layer that is directly coupled to the trench capacitor. A gate structure is formed overlying a portion of the well region. Conductivity determining ions are then implanted into other portions of the well region to form a source region and a drain region, and to define an active body region between the source region and the drain region. The active body region directly contacts the trench capacitor.

Abstract: Mechanisms for generating a worst case current waveform for testing of integrated circuit devices are provided. Architectural analysis of an integrated circuit device is first performed to determine an initial worst case power workload to be applied to the integrated circuit device. Thereafter, the derived worst case power workload is applied to a model and is simulated to generate a worst case current waveform that is input to an electrical model of the integrated circuit device to generate a worst case noise budget value. The worst case noise budget value is then compared to measured noise from application of the worst case power workload to a hardware implemented integrated circuit device. The worst case current waveform may be selected for future testing of integrated circuit devices or modifications to the simulation models may be performed and the process repeated based on the results of the comparison.

Abstract: A voltage identifier (VID) sorting system is provided that optimizes processor power and operating voltage guardband at a constant processor frequency. The VID sorting system determines a voltage versus current curve for the processor. The VID sorting system then uses the voltage versus current characteristics to calculate the power for each VID to determine an acceptable range of VIDs within the maximum power criteria. The VID sorting system then tests VIDs in the range and selects a VID from the range to optimize for minimum power and/or maximum voltage guardband at a constant processor frequency.

Abstract: A method for fabricating a memory cell is provided. A trench is formed in a semiconductor structure that comprises a semiconductor layer, and a trench capacitor is formed in the trench. Conductivity determining impurities are implanted into the semiconductor structure to create a well region in the semiconductor layer that is directly coupled to the trench capacitor. A gate structure is formed overlying a portion of the well region. Conductivity determining ions are then implanted into other portions of the well region to form a source region and a drain region, and to define an active body region between the source region and the drain region. The active body region directly contacts the trench capacitor.

Abstract: A sense amplifier based flip-flop having built-in logic functions. The flip-flop includes a first and second input circuits configured to cause complementary first and second logic values to be provided on first and second logic nodes, respectively. The flip-flop further includes a sense circuit configured to sense and capture the first and second logic values on first and second capture nodes, respectively, during an evaluation phase, and a precharge circuit configured to precharge the first and second logic node and the first and second capture nodes during a precharge phase. The flip-flop also includes a noise immunity circuit, configured to, during the evaluation phase, become active subsequent to the sense circuit capturing the first and second logic values, wherein, when activated, the noise immunity circuit prevents floating voltages on the first and second logic nodes.

Abstract: Mechanisms for modifying a test pattern to control power supply noise are provided. A portion of a sequence of states in a test sequence of a test pattern waveform is modified so as to achieve a circuit voltage, e.g., an on-chip voltage, which approximates a nominal circuit voltage, such as produced by the application of other portions of the sequence of states in the same or different test sequences. For example, hold state cycles or shift-scan state cycles may be inserted or removed prior to test state cycles in the test pattern waveform. The insertion/removal shifts the occurrence of the test state cycles within the test pattern waveform so as to adjust the voltage response of the test state cycles so that they more closely approximate a nominal voltage response. In this way, false failures due to noise in the voltage supply may be eliminated.

Abstract: A system and method for generating a worst case current waveform for testing of integrated circuit devices are provided. Architectural analysis of an integrated circuit device is first performed to determine an initial worst case power workload to be applied to the integrated circuit device. Thereafter, the derived worst case power workload is applied to a model and is simulated to generate a worst case current waveform that is input to an electrical model of the integrated circuit device to generate a worst case noise budget value. The worst case noise budget value is then compared to measured noise from application of the worst case power workload to a hardware implemented integrated circuit device. The worst case current waveform may be selected for future testing of integrated circuit devices or modifications to the simulation models may be performed and the process repeated based on the results of the comparison.

Abstract: In one embodiment, a test system tests a device under test (DUT). The DUT includes an internal test controller that executes built-in self-test (BIST programs. Built-in self-test programs include array-based automatic built-in self-test programs, discrete and combinational logic built-in self-test programs, and functional architecture verification programs (AVPs). An external manufacturing system test controller manages the internal test controller within the DUT and determines minimum operating voltage levels for a power supply input voltage that supplies the DUT. A logic simulator provides a modeling capability to further enhance the development of minimum voltage power supply input operational values for the DUT.

Abstract: A system and method for sorting processor chips based on a thermal design point are provided. With the system and method, for each processor chip, a high power workload is run on the processor chip to determine a voltage regulator module (VRM) load line. Thereafter, a thermal design point (TDP) workload is applied to the processor chip and the voltage is varied until a performance of the processor chip falls on the VRM load line. At this point, the power input to the processor chip is measured and used to sort, or bin, the processor chip. The various workloads applied have a constant frequency. From this sorting of processor chips, high speed processors that require less voltage to achieve a desired frequency and low current processors that drain less current while running at a desired frequency may be identified.

Abstract: A memory system including a memory array with redundant wordlines. The memory system includes a memory wordline tester that determines if any of the wordlines exhibits a defect. The memory system also includes decoder redundancy logic that efficiently couples to wordline shift logic using a reduced number of control signal lines therebetween. The shift logic shifts defective wordlines to upstream wordlines in the array to bypass the defective wordlines.

Abstract: A system and method for determining a guard band for an operating voltage of an integrated circuit device are provided. The system and method provide a mechanism for calculating the guard band based on a comparison of simulated noise obtained from a simulation of the integrated circuit device using a worst case waveform stimuli with simulated or measured power supply noise of a workload/test pattern that may be achieved using testing equipment. A scaling factor for the guard band is determined by comparing results of a simulation of a workload/test pattern with measured results of the workload/test pattern as applied to a hardware implementation of the integrated circuit device. This scaling factor is applied to a difference between the noise generated through simulation of the workload/test pattern and the noise generated through simulation of the worst case current waveform to generate a guard band value.

Abstract: A voltage identifier (VID) sorting system is provided that optimizes processor power and operating voltage guardband at a constant processor frequency. The VID sorting system determines a voltage versus current curve for the processor. The VID sorting system then uses the voltage versus current characteristics to calculate the power for each VID to determine an acceptable range of VIDs within the maximum power criteria. The VID sorting system then tests VIDs in the range and selects a VID from the range to optimize for minimum power and/or maximum voltage guardband at a constant processor frequency.

Abstract: In one embodiment, a test system tests a device under test (DUT). The DUT includes an internal test controller that executes built-in self-test (BIST programs. Built-in self-test programs include array-based automatic built-in self-test programs, discrete and combinational logic built-in self-test programs, and functional architecture verification programs (AVPs). An external manufacturing system test controller manages the internal test controller within the DUT and determines minimum operating voltage levels for a power supply input voltage that supplies the DUT. A logic simulator provides a modeling capability to further enhance the development of minimum voltage power supply input operational values for the DUT.

Abstract: A method and system for mitigating the impact of voltage supply variations on logic built-in self-test (LBIST) results. The method includes, but is not limited to: creating a set of customized LBIST activation patterns during IC design; propagating the activation patterns from the scan-able latches through the non-scan latches to the device under test; propagating the data from the device under test through the non-scan latches to the scan-able latches; capturing the data in a scan-able latch; and performing each test cycle independently such that the impact of voltage supply variations between test cycles is eliminated.

Abstract: A system and method for modifying a test pattern to control power supply noise are provided. A portion of a sequence of states in a test sequence of a test pattern waveform is modified so as to achieve a circuit voltage, e.g., an on-chip voltage, which approximates a nominal circuit voltage, such as produced by the application of other portions of the sequence of states in the same or different test sequences. For example, hold state cycles or shift-scan state cycles may be inserted or removed prior to test state cycles in the test pattern waveform. The insertion/removal shifts the occurrence of the test state cycles within the test pattern waveform so as to adjust the voltage response of the test state cycles so that they more closely approximate a nominal voltage response. In this way, false failures due to noise in the voltage supply may be eliminated.

Abstract: A power estimation system uses a hardware accelerated simulator to advance simulation to a point of interest for power estimation. The hardware accelerated simulator generates a checkpoint file, which is then used by a software simulator to initiate simulation of the processor design model for power estimation. An on-the-fly power estimator provides power calculations in memory. Thus, the power estimation system described herein isolates instruction sequences to determine portions of software code that may consume excess power or generate noise and to provide a more accurate power estimate on the fly.