Patents by Inventor Sang-Hee Ko Park

Sang-Hee Ko Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • P-type oxide alloys based on copper oxides, tin oxides, tin—copper alloy oxides and metal alloy thereof, and nickel oxide, with embedded metals thereof, fabrication process and use thereof
    Patent number: 9196689
    Abstract: The present invention relates to thin films comprising non-stoichiometric monoxides of: copper (OCu2)x with embedded cubic metal copper (Cucy) [(OCu2)x+(Cu1-2)y, wherein 0.05?x<1 and 0.01?y?0.9]; of tin (OSn)?x with embedded metal tin (Sn?x) [(OSn)z+(Sn1-2)w wherein 0.05?z<1 and 0.01?w?0.9]; Cucx—Sn?x alloys with embedded metal Sn and Cu [(O—Cu—Sn)a+(Cu?—Sn?)b with 0<?<2 and 0<?<2, wherein 0.05?a<1 and 0.01?b?0.9]; and of nickel (ONi)x with embedded Ni and Sn species [(O—Ni)a+(Ni?—Sn?)b with 0<?<2 and 0<?<2, wherein 0.05?a<1 and 0.01?b?0.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: November 24, 2015
    Assignees: FACULDADE DE CIENCIAS E TECHNOLOGIA DA UNIVERSIDADE NOVA DE LISBOA, ELECTRONIC AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Elvira Maria Correia Fortunato, Rodrigo Ferrão De Paiva Martins, Ana Raquel Xarouco De Barros, Nuno Filipe De Oliveira Correia, Vitor Manuel Loureiro Figueiredo, Pedro Miguel Cândido Barquinha, Sang-Hee Ko Park, Chi-Sun Hwang
  • P-TYPE OXIDE ALLOYS BASED ON COPPER OXIDES, TIN OXIDES, TIN-COPPER ALLOY OXIDES AND METAL ALLOY THEREOF, AND NICKEL OXIDE, WITH EMBEDDED METALS THEREOF, FABRICATION PROCESS AND USE THEREOF
    Publication number: 20130075740
    Abstract: The present invention relates to thin films comprising non-stoichiometric monoxides of: copper (OCu2), with embedded cubic metal copper (Cucy) [(OCu2)x+(Cu1-2)y, wherein 0.05?x<1 and 0.01?y?0.9]; of tin (OSn)?x with embedded metal tin (Sn?x) [(OSn)z+(Sn1-2)w wherein 0.05?z<1 and 0.01?w?0.9]; Cucx—Sn?x alloys with embedded metal Sn and Cu [(O—Cu—Sn)a+(Cu?—Sn?)b with 0<?<2 and 0<?<2, wherein 0.05?a<1 and 0.01?b?0.9]; and of nickel (ONi)x with embedded Ni and Sn species [(O—Ni)a+(Ni?—Sn?)b with 0<?<2 and 0<?<2, wherein 0.05?a<1 and 0.01?b?0.
    Type: Application
    Filed: April 6, 2011
    Publication date: March 28, 2013
    Applicant: Electronic and Telecommunications Research Institu te
    Inventors: Elvira Maria Correia Fortunato, Rodrigo Ferrão De Paiva Martins, Ana Raquel Xarouco De Barros, Nuno Filipe De Oliveira Correia, Vitor Manuel Loureiro Figueireido, Pedro Miguel Cândido Barquinha, Sang-Hee Ko Park, Chi-Sun Hwang